Amkor Technology Inc
Closed
SectorTechnology
51.75 4.55
Overview
Share price change
24h
Min
49.5
Max
51.77
Income | 92M 175M |
|---|---|
Sales | 213M 1.9B |
P/E Sector Avg | 21.422 93.922 |
EPS | 0.7 |
Dividend yield | 0.71 |
Profit margin | 9.246 |
Employees | 30,800 |
EBITDA | 115M 400M |
Dividend yield Sector Avg | 0.71% 2.46% |
|---|---|
Next Earnings | 26 Oct 2026 |
Next Dividend date | 22 Sept 2026 |
Next Ex Dividend date | 2 Dec 2026 |
Market Cap | -3.6B 12B |
|---|---|
Previous open | 47.2 |
Previous close | 51.75 |
News Sentiment
By Acuity
50%
50%
146 / 369 Technology
Amkor Technology Inc Chart
Past performance is not a reliable indicator of future results.
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Amkor Technology Inc Forecast
Sentiment
By Acuity
146 / 369 Technology
News Sentiment
Neutral
Volatility
Below average
News Volume (RCV)
Below average
Financials
Selling and administration expenses
Operating expenses
Pre-tax profit
Sales
Cost of sales
Gross profit on sales
Interest expense on debt
EBITDA
Operating profit
$
About Amkor Technology Inc
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
