CSCO

64.01

-0.96%↓

AMAT

171.91

-2.35%↓

PANW

191.15

-3.78%↓

CSCO

64.01

-0.96%↓

AMAT

171.91

-2.35%↓

PANW

191.15

-3.78%↓

CSCO

64.01

-0.96%↓

AMAT

171.91

-2.35%↓

PANW

191.15

-3.78%↓

CSCO

64.01

-0.96%↓

AMAT

171.91

-2.35%↓

PANW

191.15

-3.78%↓

CSCO

64.01

-0.96%↓

AMAT

171.91

-2.35%↓

PANW

191.15

-3.78%↓

Search

Aehr Test Systems

Closed

11.43 -5.3

Overview

Share price change

24h

Current

Min

11.39

Max

11.58

Key metrics

By Trading Economics

Income

-1.7M

-1M

Sales

334K

13M

P/E

Sector Avg

15.48

111.403

EPS

0.02

Profit margin

-7.641

Employees

115

EBITDA

-2.2M

-1.5M

Recommendations

By TipRanks

Recommendations

Buy

12 Months Forecast

+66.23 upside

Dividends

By Dow Jones

Next Earnings

8 Apr 2025

Market Stats

By TradingEconomics

Market Cap

345M

Previous open

16.73

Previous close

11.43

Technical Score

By Trading Central

Confidence

Strong Bullish Evidence

Aehr Test Systems Chart

Past performance is not a reliable indicator of future results.

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Peer Comparison

Price change

Aehr Test Systems Forecast

Price Target

By TipRanks

66.23% upside

12 Months Forecast

Average 19 USD  66.23%

High 19 USD

Low 19 USD

Based on 1 Wall Street analysts offering 12 month price targets forAehr Test Systems - Dist in the last 3 months.

Rating Consensus

By TipRanks

Buy

1 ratings

1

Buy

0

Hold

0

Sell

Technical Score

By Trading Central

10.5 / 12.04Support & Resistance

Short Term

Strong Bullish Evidence

Intermediate Term

Bearish Evidence

Long Term

Strong Bearish Evidence

Financials

Selling and administration expenses

Operating expenses

Pre-tax profit

Sales

Cost of sales

Gross profit on sales

Interest expense on debt

EBITDA

Operating profit

$

About Aehr Test Systems

Aehr Test Systems, Inc. provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; and FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, which allows testing, burning in, and stabilization of singulated bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.