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ORCL

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MU

388.98

-2.71%↓

NVDA

186.39

-0.77%↓

TSM

332.76

-0.61%↓

AVGO.US

324.8

+1.44%↑

ORCL

182.02

+2.76%↑

MU

388.98

-2.71%↓

NVDA

186.39

-0.77%↓

TSM

332.76

-0.61%↓

AVGO.US

324.8

+1.44%↑

ORCL

182.02

+2.76%↑

MU

388.98

-2.71%↓

NVDA

186.39

-0.77%↓

TSM

332.76

-0.61%↓

AVGO.US

324.8

+1.44%↑

ORCL

182.02

+2.76%↑

MU

388.98

-2.71%↓

NVDA

186.39

-0.77%↓

TSM

332.76

-0.61%↓

AVGO.US

324.8

+1.44%↑

ORCL

182.02

+2.76%↑

MU

388.98

-2.71%↓

Search

Aehr Test Systems

Closed

26.63 -4.93

Overview

Share price change

24h

Current

Min

26.46

Max

28.05

Key metrics

By Trading Economics

Income

-1.1M

-3.2M

Sales

-1.1M

9.9M

P/E

Sector Avg

19

58.744

Profit margin

-32.679

Employees

136

EBITDA

-2.5M

-4.4M

Recommendations

By TipRanks

Recommendations

Buy

12 Months Forecast

-10.84% downside

Dividends

By Dow Jones

Next Earnings

7 Apr 2026

Market Stats

By TradingEconomics

Market Cap

178M

882M

Previous open

31.56

Previous close

26.63

Technical Score

By Trading Central

Confidence

Weak Bearish Evidence

Aehr Test Systems Chart

Past performance is not a reliable indicator of future results.

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Peer Comparison

Price change

Aehr Test Systems Forecast

Price Target

By TipRanks

-10.84% downside

12 Months Forecast

Average 25 USD  -10.84%

High 29 USD

Low 21 USD

Based on 3 Wall Street analysts offering 12 month price targets forAehr Test Systems - Dist in the last 3 months.

Rating Consensus

By TipRanks

Buy

3 ratings

1

Buy

2

Hold

0

Sell

Technical Score

By Trading Central

8.34 / 8.7481Support & Resistance

Short Term

Weak Bearish Evidence

Intermediate Term

Strong Bearish Evidence

Long Term

Strong Bearish Evidence

Financials

Selling and administration expenses

Operating expenses

Pre-tax profit

Sales

Cost of sales

Gross profit on sales

Interest expense on debt

EBITDA

Operating profit

$

About Aehr Test Systems

Aehr Test Systems, Inc. provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; and FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, which allows testing, burning in, and stabilization of singulated bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.
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