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CRM

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NVDA

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+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

Search

Amkor Technology Inc

Suletud

SektorTehnoloogia

22.06 -0.27

Ülevaade

Aktsiahinna muutus

24h

Praegune

Min

21.71

Max

22.36

Põhinäitajad

By Trading Economics

Sissetulek

-84M

22M

Müük

-308M

1.3B

P/E

Sektori keskmine

16.75

65.857

Aktsiakasum

0.09

Dividenditootlus

1.58

Kasumimarginaal

1.654

Töötajad

28,300

EBITDA

-105M

196M

Soovitused

By TipRanks

Soovitused

Osta

12 kuu keskmine prognoos

-4.98% downside

Dividendid

By Dow Jones

Dividenditootlus

Sektori keskmine

1.58%

1.93%

Järgmine tulemuste avaldamine

28. juuli 2025

Järgmine dividendimakse kuupäev

22. sept 2025

Järgmine aktsia dividendi kuupäev (ex-date)

2. sept 2025

Turustatistika

By TradingEconomics

Turukapital

19M

5.5B

Eelmine avamishind

22.33

Eelmine sulgemishind

22.06

Uudiste sentiment

By Acuity

9%

91%

9 / 409 Pingereas Technology

Tehniline skoor

By Trading Central

Kindlus

Weak Bearish Evidence

Amkor Technology Inc Graafik

Mineviku tootlus ei ole usaldusväärne näitaja tulevaste tulemuste kohta.

Seotud uudised

9. juuli 2025, 15:46 UTC

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Tulu

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9. juuli 2025, 16:20 UTC

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9. juuli 2025, 16:20 UTC

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Omandamised, ülevõtmised, äriostud

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9. juuli 2025, 16:15 UTC

Market Talk

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9. juuli 2025, 16:14 UTC

Market Talk

Global Forex and Fixed Income Roundup: Market Talk

9. juuli 2025, 16:14 UTC

Market Talk

Rents in Canada Soften For Ninth-Straight Month -- Market Talk

9. juuli 2025, 16:14 UTC

Omandamised, ülevõtmised, äriostud

Apple Has Dropped the Ball on AI. Buying Perplexity Could Help It Catch Up, Say Analysts. -- Barrons.com

9. juuli 2025, 16:12 UTC

Market Talk

Gold Futures Broadly Flat in Largely Directionless Trade -- Market Talk

9. juuli 2025, 16:08 UTC

Market Talk

Oil Ticks Higher Amid Large U.S. Crude Build, Red Sea Tensions, Tariff Uncertainty -- Market Talk

9. juuli 2025, 15:31 UTC

Suurimad hinnamuutused turgudel

BitMine Shares Fall After Closing of $250M Private Placement

9. juuli 2025, 15:31 UTC

Market Talk
Omandamised, ülevõtmised, äriostud

With Competing Bids Unlikely, Merck's Path to Acquiring Verona Looks Smooth -- Market Talk

9. juuli 2025, 15:27 UTC

Market Talk

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9. juuli 2025, 14:36 UTC

Omandamised, ülevõtmised, äriostud

Merck to Buy Verona Pharma in $10 Billion Deal -- 2nd Update

9. juuli 2025, 14:31 UTC

Omandamised, ülevõtmised, äriostud

Meta Has Surged on the Back of AI Software. Why Hardware Is the Next Play. -- Barrons.com

9. juuli 2025, 14:26 UTC

Market Talk

Market Talk Roundup: Latest on U.S. Politics

9. juuli 2025, 14:26 UTC

Market Talk

Aug 1 Tariffs Will Boost Average Rate Near 15%, JPMorgan Estimates -- Market Talk

Võrdlus sarnastega

Hinnamuutus

Amkor Technology Inc Prognoos

Hinnasiht

By TipRanks

-4.98% langus

12 kuu keskmine prognoos

Keskmine 21 USD  -4.98%

Kõrge 25 USD

Madal 18 USD

Põhineb 8 Wall Streeti analüütiku instrumendi Amkor Technology Inc 12 kuu hinnasihil - viimase 3 kuu andmed.

Hinnangu Konsensus

By TipRanks

Osta

8 ratings

4

Osta

4

Hoia

0

Müü

Tehniline skoor

By Trading Central

17.795 / 18.14Toetus ja vastupanu

Lühikene perspektiiv

Weak Bearish Evidence

Keskpikk perspektiiv

Bullish Evidence

Pikk perspektiiv

Weak Bearish Evidence

Sentiment

By Acuity

9 / 409 Pingereas Tehnoloogia

Uudiste sentiment

Väga tugevad tõusu märgid

Volatiilsus

Alla keskmise

Uudismaht (RCV)

Alla keskmise

Finantsandmed

Müügi- ja halduskulud

Tegevuskulud

Maksueelne kasum

Müük

Müügikulu

Brutokasum müügist

Intressikulud võla pealt

EBITDA

Ärikasum

$

Ettevõttest Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.