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+3.04%↑

TSM

295.12

+1.43%↑

ORCL

284.09

+1.4%↑

ASML.US

1,034.03

-0.27%↓

NVDA

186.2

+2.21%↑

AVGO.US

354.73

+3.04%↑

TSM

295.12

+1.43%↑

ORCL

284.09

+1.4%↑

ASML.US

1,034.03

-0.27%↓

NVDA

186.2

+2.21%↑

AVGO.US

354.73

+3.04%↑

TSM

295.12

+1.43%↑

ORCL

284.09

+1.4%↑

ASML.US

1,034.03

-0.27%↓

NVDA

186.2

+2.21%↑

AVGO.US

354.73

+3.04%↑

TSM

295.12

+1.43%↑

ORCL

284.09

+1.4%↑

ASML.US

1,034.03

-0.27%↓

NVDA

186.2

+2.21%↑

AVGO.US

354.73

+3.04%↑

TSM

295.12

+1.43%↑

ORCL

284.09

+1.4%↑

ASML.US

1,034.03

-0.27%↓

Search

Amkor Technology Inc

Suletud

SektorTehnoloogia

32.78 2.47

Ülevaade

Aktsiahinna muutus

24h

Praegune

Min

32.7

Max

32.91

Põhinäitajad

By Trading Economics

Sissetulek

33M

55M

Müük

190M

1.5B

P/E

Sektori keskmine

25.619

75.654

Dividenditootlus

1.05

Kasumimarginaal

3.642

Töötajad

28,300

EBITDA

62M

259M

Soovitused

By TipRanks

Soovitused

Osta

12 kuu keskmine prognoos

-20.14% downside

Dividendid

By Dow Jones

Dividenditootlus

Sektori keskmine

1.05%

2.72%

Järgmine tulemuste avaldamine

27. okt 2025

Järgmine aktsia dividendi kuupäev (ex-date)

3. dets 2025

Turustatistika

By TradingEconomics

Turukapital

1.8B

8B

Eelmine avamishind

30.31

Eelmine sulgemishind

32.78

Uudiste sentiment

By Acuity

4%

96%

2 / 405 Pingereas Technology

Tehniline skoor

By Trading Central

Kindlus

Weak Bearish Evidence

Amkor Technology Inc Graafik

Mineviku tootlus ei ole usaldusväärne näitaja tulevaste tulemuste kohta.

Seotud uudised

25. aug 2025, 23:02 UTC

Omandamised, ülevõtmised, äriostud

The U.S. Has Created a Stealth Sovereign Wealth Fund. What Comes Next After Intel. -- Barrons.com

29. juuli 2025, 16:43 UTC

Tulu

Amkor Stock Is Soaring After Earnings. Smartphones Raise Hope for More Gains. -- Barrons.com

Võrdlus sarnastega

Hinnamuutus

Amkor Technology Inc Prognoos

Hinnasiht

By TipRanks

-20.14% langus

12 kuu keskmine prognoos

Keskmine 26.17 USD  -20.14%

Kõrge 32 USD

Madal 20 USD

Põhineb 8 Wall Streeti analüütiku instrumendi Amkor Technology Inc 12 kuu hinnasihil - viimase 3 kuu andmed.

Hinnangu Konsensus

By TipRanks

Osta

8 ratings

4

Osta

4

Hoia

0

Müü

Tehniline skoor

By Trading Central

17.795 / 18.14Toetus ja vastupanu

Lühikene perspektiiv

Weak Bearish Evidence

Keskpikk perspektiiv

Bullish Evidence

Pikk perspektiiv

Weak Bearish Evidence

Sentiment

By Acuity

2 / 405 Pingereas Tehnoloogia

Uudiste sentiment

Väga tugevad tõusu märgid

Volatiilsus

Alla keskmise

Uudismaht (RCV)

Üle keskmise

Finantsandmed

Müügi- ja halduskulud

Tegevuskulud

Maksueelne kasum

Müük

Müügikulu

Brutokasum müügist

Intressikulud võla pealt

EBITDA

Ärikasum

$

Ettevõttest Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
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