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160.37

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ASML.US

746.75

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MSFT

453.9

+0.31%↑

AAPL

211.27

+0.05%↑

TSM

193.96

-0.12%↓

ORCL

160.37

+0.76%↑

ASML.US

746.75

-1.49%↓

MSFT

453.9

+0.31%↑

AAPL

211.27

+0.05%↑

TSM

193.96

-0.12%↓

ORCL

160.37

+0.76%↑

ASML.US

746.75

-1.49%↓

MSFT

453.9

+0.31%↑

AAPL

211.27

+0.05%↑

TSM

193.96

-0.12%↓

ORCL

160.37

+0.76%↑

ASML.US

746.75

-1.49%↓

MSFT

453.9

+0.31%↑

AAPL

211.27

+0.05%↑

TSM

193.96

-0.12%↓

ORCL

160.37

+0.76%↑

ASML.US

746.75

-1.49%↓

Search

Amkor Technology Inc

Затворен

СекторТехнологични

19.73 -1.05

Преглед

Промяна на цената на акция

24 ч

Текуща

Минимум

19.51

Максимум

19.86

Ключови измерители

By Trading Economics

Приходи

-84M

22M

Продажби

-308M

1.3B

P/E

Средно за сектора

15.305

109.496

EPS

0.09

Дивидентна доходност

1.68

Марж на печалбата

1.654

Служители

28,300

EBITDA

-105M

196M

Препоръки

By TipRanks

Препоръки

Купи

12-месечна прогноза

+4.53% upside

Дивиденти

By Dow Jones

Дивидентна доходност

Средно за сектора

1.68%

2.44%

Следващи печалби

28.07.2025 г.

Следваща дата на дивидент

25.06.2025 г.

Следваща дата на екс-дивидент

5.06.2025 г.

Пазарни показатели

By TradingEconomics

Пазарна капитализация

-519M

5B

Предишно отваряне

20.78

Предишно затваряне

19.73

Техническа оценка

By Trading Central

Увереност

Weak Bearish Evidence

Amkor Technology Inc Графика

Миналото представяне не гарантира бъдещи резултати.

Свързани новини

16.05.2025 г., 19:39 ч. UTC

Значими двигатели на пазара

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Топ новини

U.S. Loses Last Triple-A Credit Rating -- 2nd Update

16.05.2025 г., 22:30 ч. UTC

Топ новини

U.S. Loses Last Triple-A Credit Rating -- Update

16.05.2025 г., 21:56 ч. UTC

Пазарно говорене

Fitch Raises Greece's Outlook to Positive From Stable -- Market Talk

16.05.2025 г., 21:56 ч. UTC

Пазарно говорене

Global Forex and Fixed Income Roundup: Market Talk

16.05.2025 г., 21:54 ч. UTC

Топ новини

U.S. Loses Last Triple-A Credit Rating -- WSJ

16.05.2025 г., 21:22 ч. UTC

Пазарно говорене

Moody's Says U.S. Fiscal Performance Likely to Deteriorate -- Market Talk

16.05.2025 г., 21:17 ч. UTC

Пазарно говорене

Treasury Yields Rise, Dollar Falls After Moody's Cuts U.S. Credit Rating -- Market Talk

16.05.2025 г., 21:17 ч. UTC

Топ новини

The Score: UnitedHealth, Walmart, Coinbase Global and More Stocks That Moved on the Week's News -- WSJ

16.05.2025 г., 21:05 ч. UTC

Пазарно говорене

Moody's Downgrades U.S. Credit Rating Due to Deficit, Debts -- Market Talk

16.05.2025 г., 20:55 ч. UTC

Придобивния, сливания и поглъщания

What's Next for Cable Giant Comcast After Charter-Cox Merger -- Barrons.com

16.05.2025 г., 20:50 ч. UTC

Пазарно говорене
Печалби

Financial Services Roundup: Market Talk

16.05.2025 г., 20:50 ч. UTC

Пазарно говорене

Basic Materials Roundup: Market Talk

16.05.2025 г., 20:37 ч. UTC

Топ новини

Trade Progress Sparks Bullish Week for Wall Street -- WSJ

16.05.2025 г., 20:33 ч. UTC

Пазарно говорене
Придобивния, сливания и поглъщания

Dick's-Foot Locker Deal Looks Like a Bet on Nike's Turnaround -- Market Talk

16.05.2025 г., 20:30 ч. UTC

Придобивния, сливания и поглъщания

Galaxy Digital Begins U.S. Trading as Bitcoin Keeps Powering Ahead -- Barrons.com

16.05.2025 г., 20:18 ч. UTC

Топ новини

Major U.S. Stock Indexes Rise; U.S. Running Out of Patience for Trade Deals -- WSJ

16.05.2025 г., 20:16 ч. UTC

Топ новини

Justice Department Wants to Spare Boeing From Guilty Plea Over 737 MAX Charges -- 3rd Update

16.05.2025 г., 20:15 ч. UTC

Печалби

Tesla Stock Rises. Even Hedge Fund Sales Can't Keep It Down. -- Barrons.com

16.05.2025 г., 20:11 ч. UTC

Придобивния, сливания и поглъщания

Henry Schein: William K. Daniel Joins Board

16.05.2025 г., 20:10 ч. UTC

Придобивния, сливания и поглъщания

Henry Schein: Strategic Investment by KKR Completed

16.05.2025 г., 20:05 ч. UTC

Придобивния, сливания и поглъщания

What's Next for Cable Giant Comcast After Charter-Cox Merger -- Barrons.com

16.05.2025 г., 19:38 ч. UTC

Пазарно говорене

Oil Futures Post Second Straight Weekly Gain -- Market Talk

16.05.2025 г., 19:07 ч. UTC

Пазарно говорене

U.S. Natural Gas Futures End Week Lower -- Market Talk

16.05.2025 г., 18:51 ч. UTC

Топ новини

Early Read on Consumer Sentiment Falls to Second Lowest on Record -- 5th Update

16.05.2025 г., 18:41 ч. UTC

Придобивния, сливания и поглъщания

What's Next for Cable Giant Comcast After Charter-Cox Merger -- Barrons.com

16.05.2025 г., 18:37 ч. UTC

Пазарно говорене

Gold Futures End Week on Negative Note -- Market Talk

16.05.2025 г., 18:35 ч. UTC

Топ новини

Ozempic Drugmaker's CEO Pushed Out Amid Weight-Loss Market Challenges -- 3rd Update

16.05.2025 г., 18:32 ч. UTC

Топ новини

Trump Floats Plan to Impose New Tariff Rates; Stocks Hold Steady -- WSJ

16.05.2025 г., 18:28 ч. UTC

Пазарно говорене

Weaker Dollar Seen as Helping Some Business to Avoid Price Increases -- Market Talk

Сравнение с други в отрасъла

Ценова промяна

Amkor Technology Inc Прогноза

Ценова цел

By TipRanks

4.53% нагоре

12-месечна прогноза

Среден 21 USD  4.53%

Висок 25 USD

Нисък 18 USD

Според 8 анализатори от Wall Street, предложили 12-месечна ценова цел за Amkor Technology Inc през последните три месеца.

Консенсусна оценка

By TipRanks

Купи

8 ratings

4

Купи

4

Задържане

0

Продай

Техническа оценка

By Trading Central

17.795 / 18.14Подкрепа & съпротива

Краткосрочен план

Weak Bearish Evidence

Средносрочен план

Bullish Evidence

Дългосрочен план

Weak Bearish Evidence

Финанси

Продажбени и админисративни разходи

Оперативни разходи

Печалба преди облагане с данъци

Продажби

Разходи за продажби

Брутна печалба от продажби

Разходи за лихви по дълг

EBITDA

Оперативна печалба

$

Относно Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.