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68.88

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CRM

269.96

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NVDA

162.73

+1.95%↑

AVGO.US

277.64

+1.23%↑

ORCL

234.96

-1.02%↓

CSCO

68.88

+0.47%↑

CRM

269.96

-1.25%↓

NVDA

162.73

+1.95%↑

AVGO.US

277.64

+1.23%↑

ORCL

234.96

-1.02%↓

CSCO

68.88

+0.47%↑

CRM

269.96

-1.25%↓

NVDA

162.73

+1.95%↑

AVGO.US

277.64

+1.23%↑

ORCL

234.96

-1.02%↓

CSCO

68.88

+0.47%↑

CRM

269.96

-1.25%↓

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Amkor Technology Inc

Отворен

СекторТехнологични

21.91 -2.19

Преглед

Промяна на цената на акция

24 ч

Текуща

Минимум

21.71

Максимум

22.43

Ключови измерители

By Trading Economics

Приходи

-84M

22M

Продажби

-308M

1.3B

P/E

Средно за сектора

16.75

65.857

EPS

0.09

Дивидентна доходност

1.58

Марж на печалбата

1.654

Служители

28,300

EBITDA

-105M

196M

Препоръки

By TipRanks

Препоръки

Купи

12-месечна прогноза

-5.53% downside

Дивиденти

By Dow Jones

Дивидентна доходност

Средно за сектора

1.58%

1.93%

Следващи печалби

28.07.2025 г.

Следваща дата на дивидент

22.09.2025 г.

Следваща дата на екс-дивидент

2.09.2025 г.

Пазарни показатели

By TradingEconomics

Пазарна капитализация

19M

5.5B

Предишно отваряне

24.1

Предишно затваряне

21.91

Настроения в новините

By Acuity

12%

88%

21 / 409 Класиране в Technology

Техническа оценка

By Trading Central

Увереност

Weak Bearish Evidence

Amkor Technology Inc Графика

Миналото представяне не гарантира бъдещи резултати.

Свързани новини

8.07.2025 г., 19:37 ч. UTC

Значими двигатели на пазара
Придобивния, сливания и поглъщания

M3-Brigade Shares Fall on Merger With ReserveOne

8.07.2025 г., 23:45 ч. UTC

Пазарно говорене

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8.07.2025 г., 23:42 ч. UTC

Пазарно говорене

Nikkei May Rise as Yen Weakens -- Market Talk

8.07.2025 г., 23:27 ч. UTC

Пазарно говорене

Australian REITs Yet to Offer Enough Appeal -- Market Talk

8.07.2025 г., 23:27 ч. UTC

Пазарно говорене

Global Equities Roundup: Market Talk

8.07.2025 г., 23:21 ч. UTC

Пазарно говорене

Summerset Bull Lauds Strong 2Q Sales Volumes -- Market Talk

8.07.2025 г., 23:21 ч. UTC

Пазарно говорене

Global Forex and Fixed Income Roundup: Market Talk

8.07.2025 г., 22:29 ч. UTC

Придобивния, сливания и поглъщания

Capricorn to Pay A$1.5 Million in Cash and Shares

8.07.2025 г., 22:28 ч. UTC

Придобивния, сливания и поглъщания

Capricorn Metals Enters Binding Agreement to Buy Claw Gold Project

8.07.2025 г., 21:58 ч. UTC

Пазарно говорене

Kura Sushi Closely Watching U.S. Tariff Negotiations on Asian Goods -- Market Talk

8.07.2025 г., 20:50 ч. UTC

Пазарно говорене

Financial Services Roundup: Market Talk

8.07.2025 г., 20:50 ч. UTC

Пазарно говорене

Tech, Media & Telecom Roundup: Market Talk

8.07.2025 г., 20:50 ч. UTC

Пазарно говорене

Basic Materials Roundup: Market Talk

8.07.2025 г., 20:15 ч. UTC

Пазарно говорене

Global Commodities Roundup: Market Talk

8.07.2025 г., 19:53 ч. UTC

Пазарно говорене

Copper Posts Biggest One-Day Gain Ever to Hit Record on Tariff Chatter -- Market Talk

8.07.2025 г., 19:53 ч. UTC

Пазарно говорене

Market Talk Roundup: Latest on U.S. Politics

8.07.2025 г., 19:45 ч. UTC

Пазарно говорене

Canada Unlikely to Succeed in Bid for Tariff-Free Trade With U.S. -- Market Talk

8.07.2025 г., 19:29 ч. UTC

Пазарно говорене

U.S. Consumer-Credit Growth Slowed in May -- Market Talk

8.07.2025 г., 19:20 ч. UTC

Пазарно говорене

U.S. Natural Gas Futures Settle Lower -- Market Talk

8.07.2025 г., 19:11 ч. UTC

Пазарно говорене

Bank of Canada's Rate Cuts Deliver Muted Relief Along the Curve -- Market Talk

8.07.2025 г., 19:01 ч. UTC

Пазарно говорене

Oil Futures Gain With Support From Products -- Market Talk

8.07.2025 г., 18:49 ч. UTC

Печалби

Hershey Names New CEO, Continuing Leadership Shuffle. The Stock Falls. -- Barrons.com

8.07.2025 г., 18:41 ч. UTC

Пазарно говорене

Mexico's Inflation Seen Mixed in June -- Market Talk

8.07.2025 г., 18:38 ч. UTC

Пазарно говорене

Gold Falls as Markets Digest Details of Trump Tariffs -- Market Talk

8.07.2025 г., 18:23 ч. UTC

Пазарно говорене

Analysts Anticipate Lower Ethanol Inventories -- Market Talk

8.07.2025 г., 18:10 ч. UTC

Пазарно говорене

Market Talk Roundup: Latest on U.S. Politics

8.07.2025 г., 18:10 ч. UTC

Пазарно говорене

Freeport-McMoRan Jumps on Trump Tariff Plan for Copper Imports -- Market Talk

8.07.2025 г., 17:24 ч. UTC

Пазарно говорене

Election, Dollar Seen as Potential Headwinds for Ibovespa -- Market Talk

8.07.2025 г., 17:06 ч. UTC

Пазарно говорене

KeyCorp and Regional Banks Set for a Catchup -- Market Talk

8.07.2025 г., 16:20 ч. UTC

Пазарно говорене

Basic Materials Roundup: Market Talk

Сравнение с други в отрасъла

Ценова промяна

Amkor Technology Inc Прогноза

Ценова цел

By TipRanks

-5.53% надолу

12-месечна прогноза

Среден 21 USD  -5.53%

Висок 25 USD

Нисък 18 USD

Според 8 анализатори от Wall Street, предложили 12-месечна ценова цел за Amkor Technology Inc през последните три месеца.

Консенсусна оценка

By TipRanks

Купи

8 ratings

4

Купи

4

Задържане

0

Продай

Техническа оценка

By Trading Central

17.795 / 18.14Подкрепа & съпротива

Краткосрочен план

Weak Bearish Evidence

Средносрочен план

Bullish Evidence

Дългосрочен план

Weak Bearish Evidence

Настроение

By Acuity

21 / 409 Класиране в Технологични

Настроения в новините

Много силни бичи доказателства

Волатилност

Под средното

Обем новини (RCV)

Под средното

Финанси

Продажбени и админисративни разходи

Оперативни разходи

Печалба преди облагане с данъци

Продажби

Разходи за продажби

Брутна печалба от продажби

Разходи за лихви по дълг

EBITDA

Оперативна печалба

$

Относно Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.