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AAPL

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MSFT

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-0.34%↓

NVDA

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+1.62%↑

AAPL

200.99

-0.08%↓

AVGO.US

269.15

-0.38%↓

TSM

228.1

+1.8%↑

MSFT

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-0.34%↓

NVDA

157.62

+1.62%↑

AAPL

200.99

-0.08%↓

AVGO.US

269.15

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TSM

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Amkor Technology Inc

Closed

SectorTechnology

21.17 -0.05

Overview

Share price change

24h

Current

Min

20.96

Max

21.3

Key metrics

By Trading Economics

Income

-84M

22M

Sales

-308M

1.3B

P/E

Sector Avg

15.828

98.221

EPS

0.09

Dividend yield

1.64

Profit margin

1.654

Employees

28,300

EBITDA

-105M

196M

Recommendations

By TipRanks

Recommendations

Buy

12 Months Forecast

-0.85% downside

Dividends

By Dow Jones

Dividend yield

Sector Avg

1.64%

2.26%

Next Earnings

28 lip 2025

Next Dividend date

22 wrz 2025

Next Ex Dividend date

2 wrz 2025

Market Stats

By TradingEconomics

Market Cap

-467M

5B

Previous open

21.22

Previous close

21.17

News Sentiment

By Acuity

16%

84%

187 / 410 Ranking in Technology

Technical Score

By Trading Central

Confidence

Weak Bearish Evidence

Amkor Technology Inc Chart

Wyniki osiągnięte w przeszłości nie są gwarantem przyszłych wyników.

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Peer Comparison

Price change

Amkor Technology Inc Forecast

Price Target

By TipRanks

-0.85% downside

12 Months Forecast

Average 21 USD  -0.85%

High 25 USD

Low 18 USD

Based on 8 Wall Street analysts offering 12 month price targets forAmkor Technology Inc - Dist in the last 3 months.

Rating Consensus

By TipRanks

Buy

8 ratings

4

Buy

4

Hold

0

Sell

Technical Score

By Trading Central

17.795 / 18.14Support & Resistance

Short Term

Weak Bearish Evidence

Intermediate Term

Bullish Evidence

Long Term

Weak Bearish Evidence

Sentiment

By Acuity

187 / 410 Ranking in Technology

News Sentiment

Very Strong Bullish Evidence

Volatility

Below average

News Volume (RCV)

Below average

Financials

Selling and administration expenses

Operating expenses

Pre-tax profit

Sales

Cost of sales

Gross profit on sales

Interest expense on debt

EBITDA

Operating profit

$

About Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.