NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

NVDA

162.9

+1.82%↑

AVGO.US

277.75

+2.25%↑

ORCL

236.28

+0.48%↑

CSCO

69.3

+1.02%↑

CRM

271.06

-1.04%↓

Search

Aehr Test Systems

Suletud

13.25 -12.48

Ülevaade

Aktsiahinna muutus

24h

Praegune

Min

12.6

Max

15.15

Põhinäitajad

By Trading Economics

Sissetulek

385K

-643K

Müük

4.9M

18M

P/E

Sektori keskmine

19

65.857

Kasumimarginaal

-3.512

Töötajad

115

EBITDA

1.3M

-210K

Turustatistika

By TradingEconomics

Turukapital

250M

464M

Eelmine avamishind

25.73

Eelmine sulgemishind

13.25

Tehniline skoor

By Trading Central

Kindlus

Weak Bearish Evidence

Aehr Test Systems Graafik

Mineviku tootlus ei ole usaldusväärne näitaja tulevaste tulemuste kohta.

Seotud uudised

10. okt 2024, 23:46 UTC

Kuumad aktsiad

Stocks to Watch: Aehr Test Systems, Stellantis, Nike

17. juuli 2024, 10:54 UTC

Tulu

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17. juuli 2024, 10:46 UTC

Tulu

Chip Gear Giant ASML Tops Q2 Views But Outlook Disappoints -- IBD

Võrdlus sarnastega

Hinnamuutus

Aehr Test Systems Prognoos

Hinnangu Konsensus

By TipRanks

Osta

2 ratings

1

Osta

1

Hoia

0

Müü

Tehniline skoor

By Trading Central

8.34 / 8.7481Toetus ja vastupanu

Lühikene perspektiiv

Weak Bearish Evidence

Keskpikk perspektiiv

Strong Bearish Evidence

Pikk perspektiiv

Strong Bearish Evidence

Finantsandmed

Müügi- ja halduskulud

Tegevuskulud

Maksueelne kasum

Müük

Müügikulu

Brutokasum müügist

Intressikulud võla pealt

EBITDA

Ärikasum

$

Ettevõttest Aehr Test Systems

Aehr Test Systems, Inc. provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; and FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, which allows testing, burning in, and stabilization of singulated bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.