ASML

1,621.2

+3.09%↑

SAP

133.2

+0.77%↑

NOKIA.FI

12.51

+1.13%↑

STMPA.FR

66.04

+2.39%↑

IFX

83.42

+3.72%↑

ASML

1,621.2

+3.09%↑

SAP

133.2

+0.77%↑

NOKIA.FI

12.51

+1.13%↑

STMPA.FR

66.04

+2.39%↑

IFX

83.42

+3.72%↑

ASML

1,621.2

+3.09%↑

SAP

133.2

+0.77%↑

NOKIA.FI

12.51

+1.13%↑

STMPA.FR

66.04

+2.39%↑

IFX

83.42

+3.72%↑

ASML

1,621.2

+3.09%↑

SAP

133.2

+0.77%↑

NOKIA.FI

12.51

+1.13%↑

STMPA.FR

66.04

+2.39%↑

IFX

83.42

+3.72%↑

ASML

1,621.2

+3.09%↑

SAP

133.2

+0.77%↑

NOKIA.FI

12.51

+1.13%↑

STMPA.FR

66.04

+2.39%↑

IFX

83.42

+3.72%↑

Search

BE Semiconductor Industries NV

Open

SectorIndices

298.8 0.95

Overzicht

Wijziging aandelenprijs

24u

Huidig

Min

288.3

Max

310.2

Belangrijke statistieken

By Trading Economics

Inkomsten

16M

59M

Verkoop

19M

185M

K/W

Sectorgemiddelde

166.823

103.354

EPS

0.65

Dividendrendement

0.51

Winstmarge

31.766

Werknemers

1,902

EBITDA

8.5M

75M

Aanbevelingen

By TipRanks

Aanbevelingen

Buy

12 Maanden Prognose

-8.52% downside

Dividenden

By Acuity

Dividendrendement

Sectorgemiddelde

0.51%

2.50%

Volgende Winsten

23 jul 2026

Marktinformatie

By TradingEconomics

Marktkapitalisatie

7.5B

25B

Vorige openingsprijs

297.85

Vorige sluitingsprijs

298.8

Nieuwssentiment

By Acuity

33%

67%

3 / 26 Rangschikking in Indices

BE Semiconductor Industries NV Grafiek

Eerdere prestaties zijn geen betrouwbare indicator voor toekomstige resultaten.

Over BE Semiconductor Industries NV

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
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