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ORCL

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ASML.US

740.39

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MSFT

455.77

+0.41%↑

AAPL

206.55

-2.23%↓

TSM

191.26

-1.39%↓

ORCL

160.41

+0.02%↑

ASML.US

740.39

-0.85%↓

MSFT

455.77

+0.41%↑

AAPL

206.55

-2.23%↓

TSM

191.26

-1.39%↓

ORCL

160.41

+0.02%↑

ASML.US

740.39

-0.85%↓

MSFT

455.77

+0.41%↑

AAPL

206.55

-2.23%↓

TSM

191.26

-1.39%↓

ORCL

160.41

+0.02%↑

ASML.US

740.39

-0.85%↓

MSFT

455.77

+0.41%↑

AAPL

206.55

-2.23%↓

TSM

191.26

-1.39%↓

ORCL

160.41

+0.02%↑

ASML.US

740.39

-0.85%↓

Search

Amkor Technology Inc

Open

SectorTechnologie

19.22 -2.58

Overzicht

Wijziging aandelenprijs

24u

Huidig

Min

19.22

Max

19.73

Belangrijke statistieken

By Trading Economics

Inkomsten

-84M

22M

Verkoop

-308M

1.3B

K/W

Sectorgemiddelde

15.305

109.496

EPS

0.09

Dividendrendement

1.68

Winstmarge

1.654

Werknemers

28,300

EBITDA

-105M

196M

Aanbevelingen

By TipRanks

Aanbevelingen

Buy

12 Maanden Prognose

+6.44% upside

Dividenden

By Dow Jones

Dividendrendement

Sectorgemiddelde

1.68%

2.44%

Volgende Winsten

28 jul 2025

Volgende dividenddatum

25 jun 2025

Volgende Ex Dividend datum

5 jun 2025

Marktinformatie

By TradingEconomics

Marktkapitalisatie

-519M

5B

Vorige openingsprijs

21.8

Vorige sluitingsprijs

19.22

Nieuwssentiment

By Acuity

78%

22%

388 / 412 Rangschikking in Technology

Technische score

By Trading Central

Vertrouwen

Weak Bearish Evidence

Amkor Technology Inc Grafiek

Eerdere prestaties zijn geen betrouwbare indicator voor toekomstige resultaten.

Gerelateerd nieuws

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16 mei 2025, 22:30 UTC

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16 mei 2025, 21:56 UTC

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16 mei 2025, 21:22 UTC

Marktinformatie

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Marktinformatie

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16 mei 2025, 20:55 UTC

Acquisities, Fusies, Overnames

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16 mei 2025, 20:50 UTC

Marktinformatie
Winsten

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Winsten

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16 mei 2025, 20:11 UTC

Acquisities, Fusies, Overnames

Henry Schein: William K. Daniel Joins Board

16 mei 2025, 20:10 UTC

Acquisities, Fusies, Overnames

Henry Schein: Strategic Investment by KKR Completed

Peer Vergelijking

Prijswijziging

Amkor Technology Inc Prognose

Koersdoel

By TipRanks

6.44% opwaarts potentieel

12 Maanden Prognose

Gemiddelde 21 USD  6.44%

Hoogste 25 USD

Laagste 18 USD

Gebaseerd op 8 Wall Street-analisten die 12-maands prijsdoelen bieden voor Amkor Technology Inc - Dist. in de afgelopen 3 maanden.

Beoordelingsconsensus

By TipRanks

Buy

8 ratings

4

Buy

4

Hold

0

Sell

Technische score

By Trading Central

17.795 / 18.14Steun & Weerstand

Korte Termijn

Weak Bearish Evidence

Gemiddeld Termijn

Bullish Evidence

Lange Termijn

Weak Bearish Evidence

Sentiment

By Acuity

388 / 412 Rangschikking in Technologie

Nieuwssentiment

Zeer Sterk Bearish Bewijs

Volatiliteit

Onder gemiddelde

Nieuws Volume (RCV)

Onder gemiddelde

Financieel

Verkoop- en administratiekosten

Bedrijfskosten

Winst voor belastingen

Verkoop

Kosten van verkopen

Brutowinst op verkopen

Rente-uitgaven op schulden

EBITDA

Operationele winst

$

Over Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.