TSM

232.52

-2.6%↓

ORCL

255.62

+1.12%↑

ASML.US

689

-1.42%↓

IBM

250.47

-0.54%↓

NOW

904.5

-2.03%↓

TSM

232.52

-2.6%↓

ORCL

255.62

+1.12%↑

ASML.US

689

-1.42%↓

IBM

250.47

-0.54%↓

NOW

904.5

-2.03%↓

TSM

232.52

-2.6%↓

ORCL

255.62

+1.12%↑

ASML.US

689

-1.42%↓

IBM

250.47

-0.54%↓

NOW

904.5

-2.03%↓

TSM

232.52

-2.6%↓

ORCL

255.62

+1.12%↑

ASML.US

689

-1.42%↓

IBM

250.47

-0.54%↓

NOW

904.5

-2.03%↓

TSM

232.52

-2.6%↓

ORCL

255.62

+1.12%↑

ASML.US

689

-1.42%↓

IBM

250.47

-0.54%↓

NOW

904.5

-2.03%↓

Search

Aehr Test Systems

Gesloten

18.53 -2.47

Overzicht

Wijziging aandelenprijs

24u

Huidig

Min

18.01

Max

19.37

Belangrijke statistieken

By Trading Economics

Inkomsten

-2.3M

-2.9M

Verkoop

-4.2M

14M

K/W

Sectorgemiddelde

19

71.636

EPS

-0.01

Winstmarge

-20.576

EBITDA

-3M

-3.2M

Dividenden

By Dow Jones

Volgende Winsten

9 okt 2025

Marktinformatie

By TradingEconomics

Marktkapitalisatie

185M

650M

Vorige openingsprijs

21

Vorige sluitingsprijs

18.53

Technische score

By Trading Central

Vertrouwen

Weak Bearish Evidence

Aehr Test Systems Grafiek

Eerdere prestaties zijn geen betrouwbare indicator voor toekomstige resultaten.

Gerelateerd nieuws

10 okt 2024, 23:46 UTC

Populaire aandelen

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Peer Vergelijking

Prijswijziging

Aehr Test Systems Prognose

Beoordelingsconsensus

By TipRanks

Buy

2 ratings

1

Buy

1

Hold

0

Sell

Technische score

By Trading Central

8.34 / 8.7481Steun & Weerstand

Korte Termijn

Weak Bearish Evidence

Gemiddeld Termijn

Strong Bearish Evidence

Lange Termijn

Strong Bearish Evidence

Financieel

Verkoop- en administratiekosten

Bedrijfskosten

Winst voor belastingen

Verkoop

Kosten van verkopen

Brutowinst op verkopen

Rente-uitgaven op schulden

EBITDA

Operationele winst

$

Over Aehr Test Systems

Aehr Test Systems, Inc. provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; and FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, which allows testing, burning in, and stabilization of singulated bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.