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ASML.US

728.38

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MSFT

523.78

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AAPL

227.37

+0.42%↑

TSM

241.83

-0.99%↓

ORCL

252.67

+0.38%↑

ASML.US

728.38

+0.03%↑

MSFT

523.78

-0.04%↓

AAPL

227.37

+0.42%↑

TSM

241.83

-0.99%↓

ORCL

252.67

+0.38%↑

ASML.US

728.38

+0.03%↑

MSFT

523.78

-0.04%↓

AAPL

227.37

+0.42%↑

TSM

241.83

-0.99%↓

ORCL

252.67

+0.38%↑

ASML.US

728.38

+0.03%↑

MSFT

523.78

-0.04%↓

AAPL

227.37

+0.42%↑

TSM

241.83

-0.99%↓

ORCL

252.67

+0.38%↑

ASML.US

728.38

+0.03%↑

Search

KLA-Tencor Corp

Atvērts

SektorsTehnoloģijas

919.8 -0.39

Pārskats

Akcijas cenas izmaiņa

24h

Šī brīža

Min

902.93

Max

930.36

Galvenie mērījumi

By Trading Economics

Ienākumi

114M

1.2B

Pārdošana

112M

3.2B

P/E

Sektora vidējais

30.109

68.029

EPS

8.41

Dividenžu ienesīgums

0.76

Peļņas marža

37.888

EBITDA

51M

1.4B

Rekomendācijas

By TipRanks

Rekomendācijas

Pirkt

Prognoze 12 mēnešiem

+5.14% upside

Dividendes

By Dow Jones

Dividenžu ienesīgums

Sektora vidējais

0.76%

3.56%

Nākamie ieņēmumi

2025. g. 29. okt.

Nākamais dividenžu datums

2025. g. 2. sept.

Nākamais Ex dividenžu datums

2025. g. 14. aug.

Tirgus statistika

By TradingEconomics

Tirgus kapitalizācija

-996M

121B

Iepriekšējā atvēršanas cena

920.19

Iepriekšējā slēgšanas cena

919.8

Ziņu noskaņojums

By Acuity

13%

87%

15 / 407 Rangs Technology

Tehniskais rādītājs

By Trading Central

Pārliecība

Bullish Evidence

KLA-Tencor Corp Grafiks

Pagātnes rezultāti nav uzticams nākotnes rezultātu rādītājs.

Saistītās ziņas

2025. g. 30. janv. 22:05 UTC

Peļņas

KLA 2Q Revenue Outpaces Guidance After AI Investment Boost

2025. g. 31. jūl. 20:05 UTC

Peļņas

KLA 4Q Net $1.2B >KLAC

2025. g. 31. jūl. 20:05 UTC

Peļņas

KLA Sees 1Q Adj EPS $7.76-Adj EPS $9.30 >KLAC

2025. g. 31. jūl. 20:05 UTC

Peļņas

KLA 4Q EPS $9.06 >KLAC

2025. g. 30. apr. 20:29 UTC

Peļņas

KLA Prio Share Repurchase Authorization Had Approximately $457 M Remaining as of March 31 >KLAC

2025. g. 30. apr. 20:29 UTC

Peļņas

KLA Raises Dividend to $1.90 Vs. $1.70 >KLAC

2025. g. 30. apr. 20:28 UTC

Peļņas

KLA 4Q Non-GAAP Gross Margin Is Expected to Be in a Range of 63.0% +/- 1.0% >KLAC

2025. g. 30. apr. 20:28 UTC

Peļņas

KLA 4Q GAAP Gross Margin Is Expected to Be in a Range of 61.7% +/- 1.0% >KLAC

2025. g. 30. apr. 20:28 UTC

Peļņas

KLA Sees 4Q Adj EPS $8.53 Plus or Minus 78c>KLAC

2025. g. 30. apr. 20:27 UTC

Peļņas

KLA Sees 4Q EPS $8.28 Plus or Minus 78c>KLAC

2025. g. 30. apr. 20:27 UTC

Peļņas

KLA Sees 4Q Rev $3.075B Plus or Minus $150M >KLAC

2025. g. 30. apr. 20:25 UTC

Peļņas

KLA Raises Dividend to $1.90 >KLAC

2025. g. 30. apr. 20:25 UTC

Peļņas

KLA >KLA $5B Increase in Shr Repurchase Authorization >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA Sees 4Q Adj EPS $7.75-Adj EPS $9.31 >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA Sees 4Q EPS $7.50-EPS $9.06 >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA 3Q EPS $8.16 >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA 3Q Net $1.09B >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA 3Q Adj EPS $8.41 >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA Corporation Reports Fiscal 2025 Third Quarter Results; Announces An Increase In The Dividend Level To $1.90 Per Share And A $5 Billion Increase In Share Repurchase Authorization >KLAC

2025. g. 30. apr. 20:05 UTC

Peļņas

KLA 3Q Rev $3.06B >KLAC

2025. g. 24. apr. 19:18 UTC

Peļņas

Lam Research Stock Rises on Earnings. How the Company Could Outperform. -- Barrons.com

2025. g. 14. febr. 13:19 UTC

Peļņas

Applied Materials Beat Quarterly Estimates. Why the Stock Is Lower. -- Barrons.com

2025. g. 30. janv. 21:18 UTC

Peļņas

KLA Sees 3Q Revenue $3B, Plus or Minus $150M

2025. g. 30. janv. 21:05 UTC

Peļņas

KLA 2Q EPS $6.16 >KLAC

2025. g. 30. janv. 21:05 UTC

Peļņas

KLA 2Q Rev $3.08B >KLAC

2025. g. 30. janv. 21:05 UTC

Peļņas

KLA 2Q Net $824.5M >KLAC

2025. g. 30. janv. 21:05 UTC

Peļņas

KLA Sees 3Q Adj EPS $7.45-Adj EPS $8.65 >KLAC

2025. g. 30. janv. 21:05 UTC

Peļņas

KLA 2Q Adj EPS $8.20 >KLAC

2025. g. 16. janv. 23:15 UTC

Iegādes, apvienošanās, pārņemšana

Advanced Micro Devices Stock Catches a Downgrade. Why This Analyst Is Concerned. -- Barrons.com

2024. g. 28. nov. 13:15 UTC

Top Ziņas

These Stocks Can Get a Black Friday Bump as U.S.-China Chip Fears Ease -- Barrons.com

Salīdzinājums

Cenas izmaiņa

KLA-Tencor Corp Prognoze

Cenas mērķis

By TipRanks

5.14% augšup

Prognoze 12 mēnešiem

Vidējais 957 USD  5.14%

Augstākais 1,070 USD

Zemākais 750 USD

Pamatojoties uz 20 Volstrītas analītiķiem, kuri piedāvā 12 mēnešu cenu mērķi KLA-Tencor Corp — pēdējo 3 mēnešu laikā.

Vērtējuma vienprātība

By TipRanks

Pirkt

20 ratings

11

Pirkt

9

Turēt

0

Pārdot

Tehniskais rādītājs

By Trading Central

694.61 / 707.84Atbalsts un pretestība

Īstermiņā

Bullish Evidence

Vidējā termiņā

Weak Bullish Evidence

Ilgtermiņā

Bearish Evidence

Noskaņojums

By Acuity

15 / 407 Rangs Tehnoloģijas

Ziņu noskaņojums

Ļoti spēcīga liecība "buļļu" tendencei

Volatilitāte

Zem vidējā

Ziņu apjoms (RCV)

Zem vidējā

Finanšu rādītāji

Pārdošanas un administrēšanas izmaksas

Darbības izmaksas

Peļņa pirms nodokļu nomaksas

Pārdošana

Pārdošanas maksa

Bruto peļņa no pārdošanas

Procentu izdevumi par parādu

EBITDA

Pamatdarbības peļņa

$

Par KLA-Tencor Corp

KLA Corporation, together with its subsidiaries, engages in the design, manufacture, and marketing of process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems that are used to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. It also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, the company offers direct imaging, inspection, optical shaping, inkjet and additive printing, UV laser drilling, and computer-aided manufacturing and engineering solutions for the PCB market; inspection and electrical testing systems to identify and classify defects, as well as systems to repair defects for the display market; and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.