NVDA

108.76

-1.89%↓

AVGO.US

192.46

+0.1%↑

ORCL

140.22

+1.33%↑

ASML.US

672.93

-0.62%↓

CRM

265.74

-0.8%↓

NVDA

108.76

-1.89%↓

AVGO.US

192.46

+0.1%↑

ORCL

140.22

+1.33%↑

ASML.US

672.93

-0.62%↓

CRM

265.74

-0.8%↓

NVDA

108.76

-1.89%↓

AVGO.US

192.46

+0.1%↑

ORCL

140.22

+1.33%↑

ASML.US

672.93

-0.62%↓

CRM

265.74

-0.8%↓

NVDA

108.76

-1.89%↓

AVGO.US

192.46

+0.1%↑

ORCL

140.22

+1.33%↑

ASML.US

672.93

-0.62%↓

CRM

265.74

-0.8%↓

NVDA

108.76

-1.89%↓

AVGO.US

192.46

+0.1%↑

ORCL

140.22

+1.33%↑

ASML.US

672.93

-0.62%↓

CRM

265.74

-0.8%↓

Search

Amkor Technology Inc

Slēgts

SektorsTehnoloģijas

17.45 -0.46

Pārskats

Akcijas cenas izmaiņa

24h

Šī brīža

Min

17.3

Max

17.78

Galvenie mērījumi

By Trading Economics

Ienākumi

-17M

106M

Pārdošana

-231M

1.6B

P/E

Sektora vidējais

11.112

86.529

EPS

0.43

Dividenžu ienesīgums

2.07

Peļņas marža

6.494

Darbinieki

28,300

EBITDA

1.5M

302M

Rekomendācijas

By TipRanks

Rekomendācijas

Pirkt

Prognoze 12 mēnešiem

+57.15% upside

Dividendes

By Dow Jones

Dividenžu ienesīgums

Sektora vidējais

2.07%

2.52%

Nākamie ieņēmumi

2025. g. 28. jūl.

Nākamais dividenžu datums

2025. g. 23. jūn.

Nākamais Ex dividenžu datums

2025. g. 2. jūn.

Tirgus statistika

By TradingEconomics

Tirgus kapitalizācija

-2.1B

3.9B

Iepriekšējā atvēršanas cena

17.91

Iepriekšējā slēgšanas cena

17.45

Tehniskais rādītājs

By Trading Central

Pārliecība

Very Strong Bullish Evidence

Amkor Technology Inc Grafiks

Pagātnes rezultāti nav uzticams nākotnes rezultātu rādītājs.

Saistītās ziņas

2025. g. 28. apr. 23:27 UTC

Top Ziņas

Woodside Energy Approves $17.5 Billion Louisiana LNG Development -- 2nd Update

2025. g. 28. apr. 23:07 UTC

Top Ziņas

Woodside Energy Approves $17.5 Billion Louisiana LNG Development -- Update

2025. g. 28. apr. 23:03 UTC

Peļņas

Waste Management 1Q Profit Falls, Revenue Misses Estimates

2025. g. 28. apr. 23:47 UTC

Tirgus saruna

Gold Edges Lower as Traders Assess Mixed Signals From Treasury Secretary Bessent -- Market Talk

2025. g. 28. apr. 23:17 UTC

Peļņas

Jiangxi Copper 1Q Rev CNY111.61B Vs. CNY122.52B >0358.HK

2025. g. 28. apr. 23:17 UTC

Peļņas

Jiangxi Copper 1Q Net CNY1.95B Vs. Net CNY1.71B >0358.HK

2025. g. 28. apr. 23:13 UTC

Peļņas

China Merchants Securities: Higher Interest Income, Fee Income Also Aided 1Q Results>600999.SH

2025. g. 28. apr. 23:13 UTC

Peļņas

China Merchants Securities 1Q Rev CNY4.71B Vs. CNY4.30B >600999.SH

2025. g. 28. apr. 23:13 UTC

Peļņas

China Merchants Securities: Gains From Investments in Financial Instruments Supported Results >600999.SH

2025. g. 28. apr. 23:13 UTC

Peļņas

China Merchants Securities 1Q Net CNY2.31B Vs. Net CNY2.16B >600999.SH

2025. g. 28. apr. 23:08 UTC

Peļņas

China Longyuan Power: 1Q Power Generation Declined 4.42% on Year>0916.HK

2025. g. 28. apr. 23:08 UTC

Peļņas

China Longyuan Power 1H Rev CNY8.14B Vs. CNY8.07B >0916.HK

2025. g. 28. apr. 23:08 UTC

Peļņas

China Longyuan Power 1H Net CNY1.98B Vs. Net CNY2.53B >0916.HK

2025. g. 28. apr. 23:04 UTC

Peļņas

Huaneng Power: 1Q Net Was Mainly Driven By Decline in Domestic Fuel Costs >0902.HK

2025. g. 28. apr. 23:04 UTC

Peļņas

Huaneng Power: Decrease in Electricity Tariffs Weighed on Rev >0902.HK

2025. g. 28. apr. 23:04 UTC

Peļņas

Huaneng Power 1Q Rev CNY60.33B ; Down 7.7% on Year>0902.HK

2025. g. 28. apr. 23:04 UTC

Peļņas

Huaneng Power 1Q Net CNY4.97B; up 8.2% on Year >0902.HK

2025. g. 28. apr. 23:00 UTC

Peļņas

Jiangsu Expressway 1Q Rev CNY4.78B Vs. CNY3.47B >0177.HK

2025. g. 28. apr. 23:00 UTC

Peļņas

Jiangsu Expressway: 1Q Rev Rose Due to Increase in Road Construction Projects >0177.HK

2025. g. 28. apr. 23:00 UTC

Peļņas

Jiangsu Expressway: Decline in Investment Income, Fall in Revenue Post Asset Disposal Weighed on 1Q Net >0177.HK

2025. g. 28. apr. 23:00 UTC

Peļņas

Jiangsu Expressway 1Q Net CNY1.21B Vs. Net CNY1.25B >0177.HK

2025. g. 28. apr. 22:57 UTC

Top Ziņas

Trump Signs Order Requiring Nationwide List of Sanctuary Cities and States -- 8th Update

2025. g. 28. apr. 22:55 UTC

Peļņas

Tsingtao Brewery: Higher Sales Volumes of Beer Supported Results >0168.HK

2025. g. 28. apr. 22:55 UTC

Peļņas

Tsingtao Brewery 1Q Net CNY1.71B Vs. Net CNY1.60B >0168.HK

2025. g. 28. apr. 22:55 UTC

Peļņas

Tsingtao Brewery 1Q Rev CNY10.45B Vs. CNY10.15B >0168.HK

2025. g. 28. apr. 22:52 UTC

Peļņas

S.F. Holding: Results Supported by Higher Contributions From Logistics Business >002352.SZ

2025. g. 28. apr. 22:52 UTC

Peļņas

S.F. Holding 1Q Net CNY2.23B Vs. Net CNY1.91B >002352.SZ

2025. g. 28. apr. 22:52 UTC

Peļņas

S.F. Holding: Cost Controls Also aided 1Q Results >002352.SZ

2025. g. 28. apr. 22:52 UTC

Peļņas

S.F. Holding 1Q Rev CNY69.85B Vs. CNY65.34B >002352.SZ

2025. g. 28. apr. 22:46 UTC

Peļņas

Shandong Gold Mining: Increase in Selling Price of Gold Supported Results>600547.SH

Salīdzinājums

Cenas izmaiņa

Amkor Technology Inc Prognoze

Cenas mērķis

By TipRanks

57.15% augšup

Prognoze 12 mēnešiem

Vidējais 27.58 USD  57.15%

Augstākais 36 USD

Zemākais 18 USD

Pamatojoties uz 8 Volstrītas analītiķiem, kuri piedāvā 12 mēnešu cenu mērķi Amkor Technology Inc — pēdējo 3 mēnešu laikā.

Vērtējuma vienprātība

By TipRanks

Pirkt

8 ratings

3

Pirkt

5

Turēt

0

Pārdot

Tehniskais rādītājs

By Trading Central

16.22 / N/AAtbalsts un pretestība

Īstermiņā

Very Strong Bullish Evidence

Vidējā termiņā

Weak Bullish Evidence

Ilgtermiņā

Weak Bearish Evidence

Finanšu rādītāji

Pārdošanas un administrēšanas izmaksas

Darbības izmaksas

Peļņa pirms nodokļu nomaksas

Pārdošana

Pārdošanas maksa

Bruto peļņa no pārdošanas

Procentu izdevumi par parādu

EBITDA

Pamatdarbības peļņa

$

Par Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.