MSFT

470.28

+0.72%↑

NVDA

141.77

+1.35%↑

AAPL

204.22

+1.92%↑

TSM

205.09

+0.93%↑

PLTR

127.72

+6.65%↑

MSFT

470.28

+0.72%↑

NVDA

141.77

+1.35%↑

AAPL

204.22

+1.92%↑

TSM

205.09

+0.93%↑

PLTR

127.72

+6.65%↑

MSFT

470.28

+0.72%↑

NVDA

141.77

+1.35%↑

AAPL

204.22

+1.92%↑

TSM

205.09

+0.93%↑

PLTR

127.72

+6.65%↑

MSFT

470.28

+0.72%↑

NVDA

141.77

+1.35%↑

AAPL

204.22

+1.92%↑

TSM

205.09

+0.93%↑

PLTR

127.72

+6.65%↑

MSFT

470.28

+0.72%↑

NVDA

141.77

+1.35%↑

AAPL

204.22

+1.92%↑

TSM

205.09

+0.93%↑

PLTR

127.72

+6.65%↑

Search

Amkor Technology Inc

Slēgts

SektorsTehnoloģijas

19.24 2.12

Pārskats

Akcijas cenas izmaiņa

24h

Šī brīža

Min

18.83

Max

19.52

Galvenie mērījumi

By Trading Economics

Ienākumi

-84M

22M

Pārdošana

-308M

1.3B

P/E

Sektora vidējais

14.742

100.397

EPS

0.09

Dividenžu ienesīgums

1.83

Peļņas marža

1.654

Darbinieki

28,300

EBITDA

-105M

196M

Rekomendācijas

By TipRanks

Rekomendācijas

Pirkt

Prognoze 12 mēnešiem

+11.52% upside

Dividendes

By Dow Jones

Dividenžu ienesīgums

Sektora vidējais

1.83%

2.33%

Nākamie ieņēmumi

2025. g. 28. jūl.

Nākamais dividenžu datums

2025. g. 25. jūn.

Nākamais Ex dividenžu datums

2025. g. 2. sept.

Tirgus statistika

By TradingEconomics

Tirgus kapitalizācija

-811M

4.7B

Iepriekšējā atvēršanas cena

17.12

Iepriekšējā slēgšanas cena

19.24

Ziņu noskaņojums

By Acuity

20%

80%

45 / 411 Rangs Technology

Tehniskais rādītājs

By Trading Central

Pārliecība

Weak Bearish Evidence

Amkor Technology Inc Grafiks

Pagātnes rezultāti nav uzticams nākotnes rezultātu rādītājs.

Saistītās ziņas

2025. g. 6. jūn. 14:31 UTC

Peļņas

New York State Retirement Fund Posts 5.84% Annual Investment Return

2025. g. 6. jūn. 20:50 UTC

Tirgus saruna

Basic Materials Roundup: Market Talk

2025. g. 6. jūn. 20:50 UTC

Tirgus saruna

Auto & Transport Roundup: Market Talk

2025. g. 6. jūn. 20:33 UTC

Peļņas

These Stocks Moved the Most Today: Tesla, DJT, Broadcom, Circle, Lululemon, Docusign, Quanex, Braze, and More -- Barrons.com

2025. g. 6. jūn. 19:36 UTC

Tirgus saruna

Oil Futures Post Solid Weekly Gains -- Market Talk

2025. g. 6. jūn. 19:28 UTC

Tirgus saruna

U.S. Natural Gas Futures Rise on Demand Expectations -- Market Talk

2025. g. 6. jūn. 18:46 UTC

Tirgus saruna

Gold Faced With Tariff Uncertainty Offset by ETF Withdrawals -- Market Talk

2025. g. 6. jūn. 18:02 UTC

Tirgus saruna

U.S. Oil Rig Count Continues to Decline -- Market Talk

2025. g. 6. jūn. 16:35 UTC

Peļņas

These Stocks Are Moving the Most Today: Tesla, DJT, Broadcom, Circle, Lululemon, Docusign, Quanex, Braze, and More -- Barrons.com

2025. g. 6. jūn. 16:34 UTC

Peļņas

These Stocks Are Moving the Most Today: Tesla, DJT, Broadcom, Circle, Lululemon, Docusign, Quanex, Braze, and More -- Barrons.com

2025. g. 6. jūn. 16:21 UTC

Tirgus saruna

Canadian Unemployment Set to Continue Feel Trade War Pressures -- Market Talk

2025. g. 6. jūn. 16:20 UTC

Tirgus saruna

Auto & Transport Roundup: Market Talk

2025. g. 6. jūn. 16:20 UTC

Tirgus saruna

Basic Materials Roundup: Market Talk

2025. g. 6. jūn. 16:20 UTC

Tirgus saruna

Health Care Roundup: Market Talk

2025. g. 6. jūn. 16:15 UTC

Tirgus saruna

Global Commodities Roundup: Market Talk

2025. g. 6. jūn. 16:07 UTC

Tirgus saruna

Market Talk Roundup: Latest on U.S. Politics

2025. g. 6. jūn. 16:07 UTC

Tirgus saruna

Base Metal Prices Slide But Copper Set to End Week Higher -- Market Talk

2025. g. 6. jūn. 15:53 UTC

Tirgus saruna

Mexican Inflation Seen Rising in May -- Market Talk

2025. g. 6. jūn. 15:36 UTC

Tirgus saruna

Dollar's Boost From U.S. Jobs Data Could Be Limited -- Market Talk

2025. g. 6. jūn. 15:36 UTC

Tirgus saruna

Global Forex and Fixed Income Roundup: Market Talk

2025. g. 6. jūn. 15:33 UTC

Tirgus saruna

Gold Futures Slide After Jobs Data Surprises to Upside -- Market Talk

2025. g. 6. jūn. 15:16 UTC

Tirgus saruna

Tesla Showing Signs of Weakness in Key Regions -- Market Talk

2025. g. 6. jūn. 15:05 UTC

Tirgus saruna

Silver at its Highest In Nearly 15 Years -- Market Talk

2025. g. 6. jūn. 14:35 UTC

Tirgus saruna

Weakening Canadian Job Market Seen Keeping BoC in Easing Mode -- Market Talk

2025. g. 6. jūn. 14:28 UTC

Tirgus saruna

Bitcoin Rises After Above-Forecast U.S. Jobs Data -- Market Talk

2025. g. 6. jūn. 14:28 UTC

Tirgus saruna

Global Forex and Fixed Income Roundup: Market Talk

2025. g. 6. jūn. 14:28 UTC

Tirgus saruna

Canada's Job Market Weakens But Not Seen Collapsing -- Market Talk

2025. g. 6. jūn. 14:15 UTC

Tirgus saruna

Oil Rises on U.S.-China Talks Optimism -- Market Talk

2025. g. 6. jūn. 14:12 UTC

Peļņas

Palantir and Super Micro Computer Stocks Rise as Broadcom Posts Strong AI Revenue -- Barrons.com

2025. g. 6. jūn. 14:09 UTC

Peļņas

Broadcom, the $1 Trillion Stock You Shouldn't Ignore, Makes AI Investment Case -- Barrons.com

Salīdzinājums

Cenas izmaiņa

Amkor Technology Inc Prognoze

Cenas mērķis

By TipRanks

11.52% augšup

Prognoze 12 mēnešiem

Vidējais 21 USD  11.52%

Augstākais 25 USD

Zemākais 18 USD

Pamatojoties uz 8 Volstrītas analītiķiem, kuri piedāvā 12 mēnešu cenu mērķi Amkor Technology Inc — pēdējo 3 mēnešu laikā.

Vērtējuma vienprātība

By TipRanks

Pirkt

8 ratings

4

Pirkt

4

Turēt

0

Pārdot

Tehniskais rādītājs

By Trading Central

17.795 / 18.14Atbalsts un pretestība

Īstermiņā

Weak Bearish Evidence

Vidējā termiņā

Bullish Evidence

Ilgtermiņā

Weak Bearish Evidence

Noskaņojums

By Acuity

45 / 411 Rangs Tehnoloģijas

Ziņu noskaņojums

Ļoti spēcīga liecība "buļļu" tendencei

Volatilitāte

Zem vidējā

Ziņu apjoms (RCV)

Zem vidējā

Finanšu rādītāji

Pārdošanas un administrēšanas izmaksas

Darbības izmaksas

Peļņa pirms nodokļu nomaksas

Pārdošana

Pārdošanas maksa

Bruto peļņa no pārdošanas

Procentu izdevumi par parādu

EBITDA

Pamatdarbības peļņa

$

Par Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.