NVDA

106.38

+3.47%↑

AVGO.US

187.98

+6.17%↑

ORCL

137.53

+4.51%↑

ASML.US

673.92

+2.48%↑

CRM

264.27

+5.32%↑

NVDA

106.38

+3.47%↑

AVGO.US

187.98

+6.17%↑

ORCL

137.53

+4.51%↑

ASML.US

673.92

+2.48%↑

CRM

264.27

+5.32%↑

NVDA

106.38

+3.47%↑

AVGO.US

187.98

+6.17%↑

ORCL

137.53

+4.51%↑

ASML.US

673.92

+2.48%↑

CRM

264.27

+5.32%↑

NVDA

106.38

+3.47%↑

AVGO.US

187.98

+6.17%↑

ORCL

137.53

+4.51%↑

ASML.US

673.92

+2.48%↑

CRM

264.27

+5.32%↑

NVDA

106.38

+3.47%↑

AVGO.US

187.98

+6.17%↑

ORCL

137.53

+4.51%↑

ASML.US

673.92

+2.48%↑

CRM

264.27

+5.32%↑

Search

Amkor Technology Inc

Slēgts

SektorsTehnoloģijas

17.37 6.04

Pārskats

Akcijas cenas izmaiņa

24h

Šī brīža

Min

16.37

Max

17.37

Galvenie mērījumi

By Trading Economics

Ienākumi

-17M

106M

Pārdošana

-231M

1.6B

P/E

Sektora vidējais

11.112

86.529

EPS

0.43

Dividenžu ienesīgums

2.07

Peļņas marža

6.494

Darbinieki

28,300

EBITDA

1.5M

302M

Rekomendācijas

By TipRanks

Rekomendācijas

Pirkt

Prognoze 12 mēnešiem

+68.17% upside

Dividendes

By Dow Jones

Dividenžu ienesīgums

Sektora vidējais

2.07%

2.52%

Nākamie ieņēmumi

2025. g. 28. apr.

Nākamais dividenžu datums

2025. g. 23. jūn.

Nākamais Ex dividenžu datums

2025. g. 2. jūn.

Tirgus statistika

By TradingEconomics

Tirgus kapitalizācija

-2.1B

3.9B

Iepriekšējā atvēršanas cena

11.33

Iepriekšējā slēgšanas cena

17.37

Tehniskais rādītājs

By Trading Central

Pārliecība

Strong Bullish Evidence

Amkor Technology Inc Grafiks

Pagātnes rezultāti nav uzticams nākotnes rezultātu rādītājs.

Saistītās ziņas

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Tirgus saruna

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Top Ziņas

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Iegādes, apvienošanās, pārņemšana

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Iegādes, apvienošanās, pārņemšana

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Top Ziņas

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Tirgus saruna

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Tirgus saruna
Peļņas

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Peļņas

Aluminum Corp. of China: Increase in Product Sales Supported 1Q Results >2600.HK

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Aluminum Corp. of China 1Q Rev CNY55.78B Vs. CNY48.96B >2600.HK

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Tirgus saruna
Peļņas

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Peļņas

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Global Equities Roundup: Market Talk

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Peļņas

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Tirgus saruna
Peļņas

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Top Ziņas

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Peļņas

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2025. g. 24. apr. 21:24 UTC

Top Ziņas
Peļņas

Google's Earnings Power Holds Up in Global Turbulence -- WSJ

2025. g. 24. apr. 21:23 UTC

Top Ziņas
Peļņas

Intel Cuts Outlook, Says Layoffs Are in Store -- WSJ

2025. g. 24. apr. 21:04 UTC

Peļņas

T-Mobile Reports Strong Earnings but Its Wireless Results Disappoint. The Stock Is Sliding. -- Barrons.com

2025. g. 24. apr. 21:03 UTC

Peļņas

Agnico-Eagle Mines Believes Its Rev Structure Will Be Largely Unaffected by the Tariffs >AEM.T

2025. g. 24. apr. 21:03 UTC

Peļņas

Agnico-Eagle Mines Total Expected Capex for 2025 Still Estimated at $1.75 B to $1.95 B >AEM.T

2025. g. 24. apr. 21:02 UTC

Peļņas

Agnico-Eagle Mines Positioned to Achieve 2025 AISC Per Ounce Guidance of $1,250 to $1,300. >AEM.T

2025. g. 24. apr. 21:02 UTC

Peļņas

Agnico-Eagle Mines Positioned to Achieve Its 2025 Total Cash Costs Per Ounce Guidance of $915 to $965 >AEM.T

Salīdzinājums

Cenas izmaiņa

Amkor Technology Inc Prognoze

Cenas mērķis

By TipRanks

68.17% augšup

Prognoze 12 mēnešiem

Vidējais 27.58 USD  68.17%

Augstākais 36 USD

Zemākais 18 USD

Pamatojoties uz 8 Volstrītas analītiķiem, kuri piedāvā 12 mēnešu cenu mērķi Amkor Technology Inc — pēdējo 3 mēnešu laikā.

Vērtējuma vienprātība

By TipRanks

Pirkt

8 ratings

3

Pirkt

5

Turēt

0

Pārdot

Tehniskais rādītājs

By Trading Central

15.99 / 16.59Atbalsts un pretestība

Īstermiņā

Strong Bullish Evidence

Vidējā termiņā

Weak Bearish Evidence

Ilgtermiņā

Weak Bearish Evidence

Finanšu rādītāji

Pārdošanas un administrēšanas izmaksas

Darbības izmaksas

Peļņa pirms nodokļu nomaksas

Pārdošana

Pārdošanas maksa

Bruto peļņa no pārdošanas

Procentu izdevumi par parādu

EBITDA

Pamatdarbības peļņa

$

Par Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.