NVDA

110.51

+0.43%↑

AVGO.US

172.47

+2.42%↑

ORCL

145.97

+2.82%↑

CRM

272.1

+0.73%↑

CSCO

61.84

+0.15%↑

NVDA

110.51

+0.43%↑

AVGO.US

172.47

+2.42%↑

ORCL

145.97

+2.82%↑

CRM

272.1

+0.73%↑

CSCO

61.84

+0.15%↑

NVDA

110.51

+0.43%↑

AVGO.US

172.47

+2.42%↑

ORCL

145.97

+2.82%↑

CRM

272.1

+0.73%↑

CSCO

61.84

+0.15%↑

NVDA

110.51

+0.43%↑

AVGO.US

172.47

+2.42%↑

ORCL

145.97

+2.82%↑

CRM

272.1

+0.73%↑

CSCO

61.84

+0.15%↑

NVDA

110.51

+0.43%↑

AVGO.US

172.47

+2.42%↑

ORCL

145.97

+2.82%↑

CRM

272.1

+0.73%↑

CSCO

61.84

+0.15%↑

Search

Amkor Technology Inc

Slēgts

SektorsTehnoloģijas

18.61 2.99

Pārskats

Akcijas cenas izmaiņa

24h

Šī brīža

Min

17.8

Max

18.64

Galvenie mērījumi

By Trading Economics

Ienākumi

-17M

106M

Pārdošana

-231M

1.6B

P/E

Sektora vidējais

12.664

96.228

EPS

0.43

Dividenžu ienesīgums

1.83

Peļņas marža

6.494

Darbinieki

28,300

EBITDA

1.5M

302M

Rekomendācijas

By TipRanks

Rekomendācijas

Pirkt

Prognoze 12 mēnešiem

+63.78% upside

Dividendes

By Dow Jones

Dividenžu ienesīgums

Sektora vidējais

1.83%

2.26%

Nākamie ieņēmumi

2025. g. 28. apr.

Nākamais dividenžu datums

2025. g. 23. jūn.

Nākamais Ex dividenžu datums

2025. g. 2. jūn.

Tirgus statistika

By TradingEconomics

Tirgus kapitalizācija

-1.6B

4.5B

Iepriekšējā atvēršanas cena

15.62

Iepriekšējā slēgšanas cena

18.61

Ziņu noskaņojums

By Acuity

50%

50%

190 / 412 Rangs Technology

Tehniskais rādītājs

By Trading Central

Pārliecība

Bearish Evidence

Amkor Technology Inc Grafiks

Pagātnes rezultāti nav uzticams nākotnes rezultātu rādītājs.

Saistītās ziņas

2025. g. 2. apr. 23:55 UTC

Karstas akcijas

Stocks to Watch: RH, Nike, Dollar Tree, Apple

2025. g. 2. apr. 22:50 UTC

Galvenie tirgus virzītāji

E.l.f. Beauty, Estee Lauder, Coty Shares Fall on Reciprocal Tariffs Hit

2025. g. 2. apr. 21:08 UTC

Peļņas

RH 4Q Revenue Misses Guidance, Looks to Offset Reciprocal Tariffs -- Update

2025. g. 2. apr. 21:00 UTC

Peļņas

RH 4Q Revenue Misses Guidance, Looks to Offset Reciprocal Tariffs

2025. g. 2. apr. 23:56 UTC

Tirgus saruna

Gold Rises as Trump's Tariffs Enhance Safe-Haven Appeal -- Market Talk

2025. g. 2. apr. 23:44 UTC

Tirgus saruna

Global Equities Roundup: Market Talk

2025. g. 2. apr. 23:44 UTC

Tirgus saruna

Nikkei Likely to Fall After U.S. Tariff Plan -- Market Talk

2025. g. 2. apr. 23:44 UTC

Top Ziņas

Some GOP Senators Break With Trump to Reject Canada Tariffs -- WSJ

2025. g. 2. apr. 23:32 UTC

Tirgus saruna

Market Talk Roundup: Latest on U.S. Politics

2025. g. 2. apr. 23:32 UTC

Tirgus saruna

Global Forex and Fixed Income Roundup: Market Talk

2025. g. 2. apr. 23:32 UTC

Tirgus saruna

Trump's Tariffs on Australia Conspicuously Unfriendly -- Market Talk

2025. g. 2. apr. 23:12 UTC

Tirgus saruna

Global Equities Roundup: Market Talk

2025. g. 2. apr. 23:12 UTC

Tirgus saruna

Trump Tariff 'Blow Bigger Than We Expected,' Capital Economics Says -- Market Talk

2025. g. 2. apr. 23:10 UTC

Tirgus saruna

Canada, Mexico Get Short-Term Advantage From Trump's Tariff Moves -- Market Talk

2025. g. 2. apr. 23:09 UTC

Tirgus saruna

U.S. Effective Tariff Rate Highest in 131 Years -- Market Talk

2025. g. 2. apr. 23:09 UTC

Tirgus saruna

Market Talk Roundup: Latest on U.S. Politics

2025. g. 2. apr. 22:57 UTC

Tirgus saruna

Australia Spared Worst Of US Tariff Hikes -- Market Talk

2025. g. 2. apr. 22:56 UTC

Tirgus saruna

Market Talk Roundup: Latest on U.S. Politics

2025. g. 2. apr. 22:56 UTC

Tirgus saruna

US Equity Futures Down as Tariff Hikes Stoke Recession Fears -- Market Talk

2025. g. 2. apr. 22:43 UTC

Top Ziņas
Iegādes, apvienošanās, pārņemšana

AppLovin, Amazon Emerge as TikTok Bidders Ahead of Trump's Deadline, Sources Say -- 2nd Update

2025. g. 2. apr. 22:12 UTC

Tirgus saruna

Trump's Tariff Order May Set Path for New U.S.-Canada Pact -- Market Talk

2025. g. 2. apr. 21:48 UTC

Top Ziņas

The Stock Market Pain Is Just Getting Started. 'This is How You Sabotage the World's Economic Engine.' -- Barrons.com

2025. g. 2. apr. 21:41 UTC

Tirgus saruna

USD Reaction To Trump's Tariffs Limited So far -- Market Talk

2025. g. 2. apr. 21:17 UTC

Tirgus saruna

Market Talk Roundup: Latest on U.S. Politics

2025. g. 2. apr. 21:17 UTC

Tirgus saruna

Global Forex and Fixed Income Roundup: Market Talk

2025. g. 2. apr. 21:17 UTC

Tirgus saruna

Mexican Peso Gains as Worst Tariff Fears Avoided -- Market Talk

2025. g. 2. apr. 21:04 UTC

Top Ziņas

Trump's Tariffs Could Blow Up Big Pharma's Tax Shelter -- Heard on the Street -- Update

2025. g. 2. apr. 21:03 UTC

Tirgus saruna

Treasury Yields, Dollar, Stock Futures Fall as Markets Digest Tariffs -- Market Talk

2025. g. 2. apr. 20:53 UTC

Peļņas

Kaiser Aluminum Changes Method From Last-In, First-Out to Weighted Avg Cost Effective Jan. 1, 2025

2025. g. 2. apr. 20:52 UTC

Peļņas

Kaiser Aluminum Changes Inventory Acctg Methodology

Salīdzinājums

Cenas izmaiņa

Amkor Technology Inc Prognoze

Cenas mērķis

By TipRanks

63.78% augšup

Prognoze 12 mēnešiem

Vidējais 29.66 USD  63.78%

Augstākais 36 USD

Zemākais 24 USD

Pamatojoties uz 8 Volstrītas analītiķiem, kuri piedāvā 12 mēnešu cenu mērķi Amkor Technology Inc — pēdējo 3 mēnešu laikā.

Vērtējuma vienprātība

By TipRanks

Pirkt

8 ratings

5

Pirkt

3

Turēt

0

Pārdot

Tehniskais rādītājs

By Trading Central

17.605 / 19.55Atbalsts un pretestība

Īstermiņā

Bearish Evidence

Vidējā termiņā

Bearish Evidence

Ilgtermiņā

Bearish Evidence

Noskaņojums

By Acuity

190 / 412 Rangs Tehnoloģijas

Ziņu noskaņojums

Neutral

Volatilitāte

Zem vidējā

Ziņu apjoms (RCV)

Zem vidējā

Finanšu rādītāji

Pārdošanas un administrēšanas izmaksas

Darbības izmaksas

Peļņa pirms nodokļu nomaksas

Pārdošana

Pārdošanas maksa

Bruto peļņa no pārdošanas

Procentu izdevumi par parādu

EBITDA

Pamatdarbības peļņa

$

Par Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.