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Amkor Technology Inc

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BrancheTechnologie

58.79 1.89

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Übersicht

Veränderung der Aktienkurses

24h

Aktuell

Min

57.22

Max

60.32

Schlüsselkennzahlen
By Trading Economics
Einkommen	92M 175M
Verkäufe	213M 1.9B
KGV Branchendurchschnitt	23.709 88.129
EPS	0.7
Dividendenrendite	0.6
Gewinnspanne	9.246
Angestellte	30,800
EBITDA	115M 400M

Empfehlungen
By TipRanks
Empfehlungen	Buy
12-Monats-Prognose	+31.6% upside

Dividenden
By Acuity
Dividendenrendite Branchendurchschnitt	0.60% 3.62%
Nächstes Ergebnis	26. Okt. 2026
Nächste Dividendenausschüttung	22. Sept. 2026
Nächstes Ex-Dividendendatum	2. Sept. 2026

Marktstatistiken
By TradingEconomics
Marktkapitalisierung	-2.4B 13B
Vorheriger Eröffnungskurs	56.9
Vorheriger Schlusskurs	58.79

Nachrichtenstimmung

By Acuity

97%

1 / 370 Ranking in Technology

Amkor Technology Inc Chart

Vergangene Performances sind kein verlässlicher Indikator für zukünftige Ergebnisse.

Peer-Vergleich

Kursveränderung

Amkor Technology Inc Prognose

Kursziel

By TipRanks

31.6% Vorteil

12-Monats-Prognose

Durchschnitt 76 USD 31.6%

Hoch 90 USD

Tief 65 USD

Basierend auf 6 Wall-Street-Analysten, die in den letzten 3 Monaten 12-Monats-Kursziele für Amkor Technology Inc – Dist angeboten haben.

Rating-Konsens

By TipRanks

Buy

6 ratings

Buy

Halten

Sell

Basierend auf 6 Analysten, die in den letzten 3 Monaten Aktienbewertungen für Amkor Technology Inc – Dist abgegeben haben.

Stimmung

By Acuity

1 / 370 Ranking in Technologie

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Bruttogewinn aus dem Verkauf

Zinsaufwand für Schulden

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Betriebsergebnis

Über Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.