NVDA

178.72

+0.68%↑

AVGO.US

300.44

+0.78%↑

TSM

243.42

+0.22%↑

ORCL

250.17

+0.58%↑

ASML.US

721.16

+0.45%↑

NVDA

178.72

+0.68%↑

AVGO.US

300.44

+0.78%↑

TSM

243.42

+0.22%↑

ORCL

250.17

+0.58%↑

ASML.US

721.16

+0.45%↑

NVDA

178.72

+0.68%↑

AVGO.US

300.44

+0.78%↑

TSM

243.42

+0.22%↑

ORCL

250.17

+0.58%↑

ASML.US

721.16

+0.45%↑

NVDA

178.72

+0.68%↑

AVGO.US

300.44

+0.78%↑

TSM

243.42

+0.22%↑

ORCL

250.17

+0.58%↑

ASML.US

721.16

+0.45%↑

NVDA

178.72

+0.68%↑

AVGO.US

300.44

+0.78%↑

TSM

243.42

+0.22%↑

ORCL

250.17

+0.58%↑

ASML.US

721.16

+0.45%↑

Search

Amkor Technology Inc

Abierto

SectorTecnología

23.89 -5.5

Resumen

Variación precio

24h

Actual

Mínimo

23.1

Máximo

25.47

Métricas clave

By Trading Economics

Ingresos

-84M

22M

Ventas

-308M

1.3B

P/B

Media del Sector

17.148

70.924

BPA

0.09

Rentabilidad por dividendo

1.5

Margen de beneficio

1.654

Empleados

28,300

EBITDA

-105M

196M

Recomendaciones

By TipRanks

Recomendaciones

Comprar

Estimación a 12 meses

+15.4% upside

Dividendos

By Dow Jones

Rentabilidad por dividendo

Media del Sector

1.50%

2.51%

Próximas Ganancias

27 oct 2025

Fecha Próximo Dividendo

22 sept 2025

Próxima Fecha de Ex Dividendo

2 sept 2025

Estadísticas de Mercado

By TradingEconomics

Capitalización de Mercado

-50M

5.4B

Apertura anterior

29.39

Cierre anterior

23.89

Noticias sobre sentimiento de mercado

By Acuity

14%

86%

21 / 407 Clasificación en Technology

Puntuación técnica

By Trading Central

Confianza

Weak Bearish Evidence

Amkor Technology Inc Gráfico

El rendimiento pasado no es un indicador fiable de resultados futuros.

Noticias Relacionadas

29 jul 2025, 16:43 UTC

Ganancias

Amkor Stock Is Soaring After Earnings. Smartphones Raise Hope for More Gains. -- Barrons.com

Comparación entre iguales

Cambio de precio

Amkor Technology Inc Esperado

Precio Objetivo

By TipRanks

15.4% repunte

Estimación a 12 meses

Media 24.5 USD  15.4%

Máximo 30 USD

Mínimo 20 USD

De acuerdo con 7 analistas de Wall Street que ofrecen objetivos de precios a 12 meses para Amkor Technology Inc Dist en los últimos 3 meses.

Consenso

By TipRanks

Comprar

7 ratings

3

Comprar

4

Mantener

0

Vender

Puntuación técnica

By Trading Central

17.795 / 18.14Soporte y Resistencia

Corto Plazo

Weak Bearish Evidence

Medio plazo

Bullish Evidence

Largo Plazo

Weak Bearish Evidence

Sentimiento

By Acuity

21 / 407 Clasificación en Tecnología

Noticias sobre sentimiento de mercado

Coyuntura alcista notoria

Volatilidad

Por debajo de la media

Volumen de Noticias (RCV)

Por encima de la media

Finanzas

Gastos de venta y administración

Gastos operativos

Beneficio antes de impuestos

Ventas

Coste de ventas

Beneficio bruto de ventas

Gasto por intereses de deuda

EBITDA

Beneficio operativo

$

Acerca de Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.