NVDA

108.99

+3.43%↑

AVGO.US

188.02

+1.61%↑

ORCL

137.42

+1.19%↑

ASML.US

669.89

-0.11%↓

CRM

266.75

+1.9%↑

NVDA

108.99

+3.43%↑

AVGO.US

188.02

+1.61%↑

ORCL

137.42

+1.19%↑

ASML.US

669.89

-0.11%↓

CRM

266.75

+1.9%↑

NVDA

108.99

+3.43%↑

AVGO.US

188.02

+1.61%↑

ORCL

137.42

+1.19%↑

ASML.US

669.89

-0.11%↓

CRM

266.75

+1.9%↑

NVDA

108.99

+3.43%↑

AVGO.US

188.02

+1.61%↑

ORCL

137.42

+1.19%↑

ASML.US

669.89

-0.11%↓

CRM

266.75

+1.9%↑

NVDA

108.99

+3.43%↑

AVGO.US

188.02

+1.61%↑

ORCL

137.42

+1.19%↑

ASML.US

669.89

-0.11%↓

CRM

266.75

+1.9%↑

Search

Amkor Technology Inc

Deschisă

SectorTehnologie

17.36 1.11

Rezumat

Modificarea prețului

24h

Curent

Minim

17

Maxim

17.42

Indicatori cheie

By Trading Economics

Venit

-17M

106M

Vânzări

-231M

1.6B

P/E

Medie Sector

11.112

86.529

EPS

0.43

Randament dividend

2.07

Marjă de profit

6.494

Angajați

28,300

EBITDA

1.5M

302M

Recomandări

By TipRanks

Recomandări

Cumpărare

Prognoză pe 12 luni

+68.17% upside

Dividende

By Dow Jones

Randament dividend

Medie Sector

2.07%

2.52%

Următoarele câștiguri

28 apr. 2025

Data viitoare de dividende

23 iun. 2025

Următoarea dată ex-dividende

2 iun. 2025

Statistici piață

By TradingEconomics

Capitalizare de piață

-2.1B

3.9B

Deschiderea anterioară

16.25

Închiderea anterioară

17.36

Scor tehnic

By Trading Central

Încredere

Very Strong Bullish Evidence

Amkor Technology Inc Grafic

Performanțele din trecut nu reprezintă un indicator fiabil al rezultatelor viitoare.

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Comparație

Modificare preț

Amkor Technology Inc Așteptări

Obiectiv de preț

By TipRanks

68.17% sus

Prognoză pe 12 luni

Medie 27.58 USD  68.17%

Maxim 36 USD

Minim 18 USD

În baza a 8 analiști de pe Wall Street care oferă obiective de preț pe 12 luni pentruAmkor Technology Inc - Dist în ultimele 3 luni.

Consens privind evaluarea

By TipRanks

Cumpărare

8 ratings

3

Cumpărare

5

Păstrare

0

Vânzare

Scor tehnic

By Trading Central

16.22 / 17.49Suport & Rezistență

Termen scurt

Very Strong Bullish Evidence

Termen mediu

Weak Bearish Evidence

Termen lung

Weak Bearish Evidence

Date financiare

Cheltuieli de vânzare și administrare

Cheltuieli de exploatare

Profit pre-impozitare

Vânzări

Costul vânzărilor

Profit brut din vânzări

Cheltuieli cu dobânzile pe datorie

EBITDA

Profit operațional

$

Despre Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.