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Amkor Technology Inc

Uždarymo kaina

SektoriusTechnologijų sektorius

19.87 -2.45

Apžvalga

Akcijų kainos pasikeitimas

24 val.

Dabar

Min

19.77

Max

20.23

Pagrindiniai rodikliai

By Trading Economics

Pajamos

-84M

22M

Pardavimai

-308M

1.3B

P/E

Sektoriaus vid.

15.523

97.882

Pelnas, tenkantis vienai akcijai

0.09

Dividendų pajamingumas

1.72

Pelno marža

1.654

Darbuotojai

28,300

EBITDA

-105M

196M

Rekomendacijos

By TipRanks

Rekomendacijos

Pirkti

12 mėnesių prognozė

+2.99% upside

Dividendai

By Dow Jones

Dividendų pajamingumas

Sektoriaus vid.

1.72%

2.26%

Kitas uždarbis

2025-07-28

Kitas dividendų mokėjimo data

2025-06-25

Kita Ex Dividend data

2025-09-02

Rinkos statistika

By TradingEconomics

Rinkos kapitalizacija

-564M

4.9B

Ankstesnė atidarymo kaina

22.32

Ankstesnė uždarymo kaina

19.87

Naujienos nuotaikos

By Acuity

50%

50%

183 / 410 reitingas Technology

Techninis įvertinimas

By Trading Central

Pasitikėjimas

Weak Bearish Evidence

Amkor Technology Inc Grafikas

Ankstesni rezultatai nėra patikimas būsimų rezultatų rodiklis.

Susijusios naujienos

2025-06-13 22:33; UTC

Įsigijimai, susijungimai, perėmimai

Millicom to Acquire Telefonica Ecuador for $380 Million

2025-06-13 23:50; UTC

Įsigijimai, susijungimai, perėmimai

Trump and Nippon Steel Reach National-Security Agreement on U.S. Steel Deal -- 2nd Update

2025-06-13 23:20; UTC

Įsigijimai, susijungimai, perėmimai

Trump and Nippon Steel Reach National-Security Agreement on U.S. Steel Deal -- Update

2025-06-13 23:09; UTC

Įsigijimai, susijungimai, perėmimai

Trump, Nippon Steel Reach National-Security Agreement on U.S. Steel Deal -- WSJ

2025-06-13 23:03; UTC

Įsigijimai, susijungimai, perėmimai

Trump, Nippon Steel Reach National-Security Agreement on U.S. Steel Deal --WSJ

2025-06-13 22:18; UTC

Įsigijimai, susijungimai, perėmimai

Millicom to Acquire Telefonica Ecuador for $380M

2025-06-13 22:04; UTC

Rinkos pokalbiai
Įsigijimai, susijungimai, perėmimai

Better Data Facilitate Investments In Oil Patch -- Market Talk

2025-06-13 21:42; UTC

Įsigijimai, susijungimai, perėmimai

Anne Wojcicki Wins Bidding for 23andMe -- 2nd Update

2025-06-13 21:35; UTC

Įsigijimai, susijungimai, perėmimai

Bunge: Outside Date Extended to July 3

2025-06-13 21:35; UTC

Įsigijimai, susijungimai, perėmimai

Bunge: Subject to Satisfaction of Remaining Conditions, Bunge and Sellers Expect to Complete Transaction July 2

2025-06-13 21:34; UTC

Įsigijimai, susijungimai, perėmimai

Bunge Gets Mexico Approval for Viterra Deal

2025-06-13 21:32; UTC

Įsigijimai, susijungimai, perėmimai

Bunge Gets China Approval for Viterra Deal

2025-06-13 20:50; UTC

Rinkos pokalbiai

Basic Materials Roundup: Market Talk

2025-06-13 20:45; UTC

Įsigijimai, susijungimai, perėmimai

23andMe: TTAM Makes Binding Commitments for Additional Consumer Protections and Privacy Safeguards

2025-06-13 20:34; UTC

Įsigijimai, susijungimai, perėmimai

Anne Wojcicki Wins Bidding for 23andMe -- Update

2025-06-13 20:14; UTC

Įsigijimai, susijungimai, perėmimai

Nonprofit Controlled By 23andMe Co-Founder Anne Wojcicki Would Buy the DNA-Testing Company for $305 Million -- WSJ

2025-06-13 20:14; UTC

Įsigijimai, susijungimai, perėmimai

Anne Wojcicki Wins Bidding for 23andMe -- WSJ

2025-06-13 20:14; UTC

Įsigijimai, susijungimai, perėmimai

Regeneron Walks Away From 23andMe Acquisition After Wojcicki's Higher Bid -- WSJ

2025-06-13 19:30; UTC

Rinkos pokalbiai

U.S. Natural Gas Futures Post Moderate Gains -- Market Talk

2025-06-13 19:12; UTC

Rinkos pokalbiai

Oil Futures Jump As Israel Strikes Iranian Targets -- Market Talk

2025-06-13 19:04; UTC

Rinkos pokalbiai

Canada Military Spending Hike to Lift Long-Term Yields -- Market Talk

2025-06-13 18:54; UTC

Rinkos pokalbiai

Correction to Gold Settles Market Talk

2025-06-13 18:01; UTC

Rinkos pokalbiai

Gold Settles at Record High -- Market Talk

2025-06-13 17:40; UTC

Rinkos pokalbiai

U.S. Oil Rig Count Falls By 3 to 439 -- Market Talk

2025-06-13 17:21; UTC

Rinkos pokalbiai

Dollar Index, Commodities Rise -- Market Talk

2025-06-13 17:02; UTC

Įsigijimai, susijungimai, perėmimai

Advent Proposal Values Spectris at GBP37.63 Per Share, Company Said Monday -- WSJ

2025-06-13 17:02; UTC

Įsigijimai, susijungimai, perėmimai

KKR Is Preparing a Bid for High-Tech Instrument Maker Spectris, Sources Say -- WSJ

2025-06-13 17:02; UTC

Įsigijimai, susijungimai, perėmimai

Private-Equity Firm Is Vying With Advent for the U.K. Company, Sources Say -- WSJ

2025-06-13 17:02; UTC

Įsigijimai, susijungimai, perėmimai

KKR Making Competing Bid for Equipment Maker Spectris -- WSJ

2025-06-13 16:20; UTC

Rinkos pokalbiai

Auto & Transport Roundup: Market Talk

Amkor Technology Inc Prognozė

Kainos tikslas

By TipRanks

2.99% į viršų

12 mėnesių prognozė

Vidutinis 21 USD  2.99%

Aukščiausias 25 USD

Žemiausias 18 USD

Remiantis 8 „Wall Street“ analitikais, siūlančiais 12 mėnesių tikslines Amkor Technology Inc kainas – Dist per pastaruosius 3 mėnesius.

Bendras įvertinimas

By TipRanks

Pirkti

8 ratings

4

Pirkti

4

Laikyti

0

Parduoti

Techninis įvertinimas

By Trading Central

17.795 / 18.14Palaikymas ir pasipriešinimas

Trumpalaikis periodas

Weak Bearish Evidence

Vidutinės trukmės periodas

Bullish Evidence

Ilgalaikis periodas

Weak Bearish Evidence

Rinkos nuotaikos

By Acuity

183 / 410 reitingas Technologijų sektorius

Naujienos nuotaikos

Neutral

Svyravimai

Žemiau vidurkio

Naujienų apimtis (RCV)

Žemiau vidurkio

Finansinės naujienos

Pardavimo ir administravimo išlaidos

Veiklos sąnaudos

Ikimokestinis pelnas

Pardavimai

Pardavimo savikaina

Bendrasis pelnas iš pardavimo

Skolų palūkanų išlaidos

EBITDA

Veiklos pelnas

$

Apie bendrovę Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.