NVDA

189.16

-0.34%↓

AVGO.US

341

+0.16%↑

ORCL

289.09

-0.16%↓

CSCO

68.33

-0.31%↓

CRM

240.73

+1.33%↑

NVDA

189.16

-0.34%↓

AVGO.US

341

+0.16%↑

ORCL

289.09

-0.16%↓

CSCO

68.33

-0.31%↓

CRM

240.73

+1.33%↑

NVDA

189.16

-0.34%↓

AVGO.US

341

+0.16%↑

ORCL

289.09

-0.16%↓

CSCO

68.33

-0.31%↓

CRM

240.73

+1.33%↑

NVDA

189.16

-0.34%↓

AVGO.US

341

+0.16%↑

ORCL

289.09

-0.16%↓

CSCO

68.33

-0.31%↓

CRM

240.73

+1.33%↑

NVDA

189.16

-0.34%↓

AVGO.US

341

+0.16%↑

ORCL

289.09

-0.16%↓

CSCO

68.33

-0.31%↓

CRM

240.73

+1.33%↑

Search

Amkor Technology Inc

Ouvert

SecteurTechnologie

29.56 -0.07

Résumé

Variation du prix de l'action

24h

Actuel

Min

29.33

Max

30.02

Chiffres clés

By Trading Economics

Revenu

33M

55M

Ventes

190M

1.5B

P/E

Moyenne du Secteur

23.377

76.739

Rendement du dividende

1.13

Marge bénéficiaire

3.642

Employés

28,300

EBITDA

62M

259M

Recommandations

By TipRanks

Recommandations

Achat

Prévisions sur 12 Mois

-15.64% downside

Dividendes

By Dow Jones

Rendement du dividende

Moyenne du Secteur

1.13%

2.64%

Prochains Résultats

27 oct. 2025

Date du Prochain Détachement de Dividende

3 déc. 2025

Statistiques du Marché

By TradingEconomics

Capitalisation Boursière

852M

7B

Ouverture précédente

29.63

Clôture précédente

29.56

Sentiment de l'Actualité

By Acuity

50%

50%

162 / 407 Classement par Technology

Score Technique

By Trading Central

Confiance

Weak Bearish Evidence

Amkor Technology Inc Graphique

Les performances passées ne sont pas un indicateur fiable des résultats futurs.

Actualités Associées

25 août 2025, 23:02 UTC

Acquisitions, Fusions, Rachats

The U.S. Has Created a Stealth Sovereign Wealth Fund. What Comes Next After Intel. -- Barrons.com

29 juil. 2025, 16:43 UTC

Résultats

Amkor Stock Is Soaring After Earnings. Smartphones Raise Hope for More Gains. -- Barrons.com

Comparaison

Variation de prix

Amkor Technology Inc prévision

Objectif de Prix

By TipRanks

-15.64% baisse

Prévisions sur 12 Mois

Moyen 24.86 USD  -15.64%

Haut 30 USD

Bas 20 USD

Basé sur 8 analystes de Wall Street proposant des objectifs de prix à 12 mois pour Microsoft Corp. au cours des 3 derniers mois.

Note du Consensus

By TipRanks

Achat

8 ratings

4

Achat

4

Maintien

0

Vente

Score Technique

By Trading Central

17.795 / 18.14Support & Résistance

Court Terme

Weak Bearish Evidence

Moyen Terme

Bullish Evidence

Long Terme

Weak Bearish Evidence

Sentiment

By Acuity

162 / 407Classement par Technologie

Sentiment de l'Actualité

Neutral

Volatilité

Inférieur à la moyenne

Changement du Volume d'Actualités (RCV)

Inférieur à la moyenne

Éléments financiers

Frais Généraux et Administratifs

Dépenses d'exploitation

Résultat avant impôt

Ventes

Coût des ventes

Marge brute des ventes

Charges d'intérêt sur la dette

EBITDA

Bénéfice d'exploitation

$

À Propos Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
help-icon Live chat