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Amkor Technology Inc

Закрыт

СекторТехнологии

55.25 2.14

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Обзор

Изменение цены акций

24 ч

Текущая

Мин.

54.66

Макс.

55.31

Ключевые показатели
By Trading Economics
Доход	92M 175M
Продажи	213M 1.9B
P/E Средняя по отрасли	22.798 93.625
Прибыль на акцию	0.7
Дивидендная доходность	0.67
Рентабельность продаж	9.246
Сотрудники	30,800
EBITDA	115M 400M

Рекомендации
By TipRanks
Рекомендации	Покупка
Прогноз на 12 месяцев	+37.51% upside

Дивиденды
By Acuity
Дивидендная доходность Средняя по отрасли	0.67% 3.71%
Следующий отчет о доходах	26 окт. 2026 г.
Дата следующей выплаты дивидендов	22 сент. 2026 г.
Следующая эксдивидендная дата	2 сент. 2026 г.

Рыночная статистика
By TradingEconomics
Рыночная капитализация	-2.9B 13B
Предыдущая цена открытия	53.11
Предыдущая цена закрытия	55.25

Новостные настроения

By Acuity

23%

77%

45 / 370 Рейтинг в Technology

Amkor Technology Inc График

Прошлые результаты не являются надежным индикатором будущих результатов.

Связанные новости

7 авг. 2026 г., 19:46 UTC

Correlated Moves

Amkor Technology Inc shares are higher amid positive sentiment in the semiconductor sector, influenced by Onto Innovation Inc's notable gains.

6 авг. 2026 г., 19:26 UTC

News

Correlated Moves

Amkor Technology reports record Q2 revenue of $1.90 billion, driven by long-term contracts with TSMC and NVIDIA. Shares are gaining amid positive analyst upgrades.

5 авг. 2026 г., 19:51 UTC

Correlated Moves

Amkor Technology Inc shares are lower today, influenced by a decline in the broader Semiconductor Materials & Equipment sector and high market volume.

4 авг. 2026 г., 23:06 UTC

Correlated Moves

Amkor Technology Inc shares declined during after-market hours, reflecting broader weakness in the semiconductor sector and trading below their 20-day moving average.

3 авг. 2026 г., 23:41 UTC

Correlated Moves

Amkor Technology Inc gains in after-market trading, reflecting positive momentum following a recovery from earlier session dips. The stock remains below its 20-day moving average.

31 июл. 2026 г., 20:03 UTC

Correlated Moves

Social Media

Amkor Technology Inc is gaining traction, supported by Monolithic Power Systems Inc's price increase, despite earlier pulling back from a session high.

30 июл. 2026 г., 23:41 UTC

Correlated Moves

Amkor Technology Inc. is higher in after-market hours, reflecting broader market momentum and positive performance in the semiconductor sector.

29 июл. 2026 г., 23:41 UTC

Correlated Moves

Amkor Technology Inc. is higher in after-market hours, reflecting broader market gains. The Nasdaq 100 Index rose, contributing to Amkor's upward movement.

28 июл. 2026 г., 23:51 UTC

Social Media

Correlated Moves

Amkor Technology Inc is rising in after-market trading following a shift of lower-margin SiP production to Vietnam, preserving Korean facilities for higher-margin products.

27 июл. 2026 г., 23:51 UTC

News

Social Media

Amkor Technology's shares declined in after-market trading following weaker-than-expected third-quarter revenue guidance despite strong second-quarter results and earnings.

24 июл. 2026 г., 19:32 UTC

News

Correlated Moves

Social Media

Amkor Technology shares lower today despite a $1.5 billion partnership announcement with NVIDIA to enhance semiconductor packaging capacity in Arizona.

23 июл. 2026 г., 23:02 UTC

Social Media

News

Amkor Technology announced a $1.5 billion partnership with NVIDIA to enhance packaging capacity, boosting shares significantly in after-market hours.

22 июл. 2026 г., 23:36 UTC

Amkor Technology Inc shares are higher in after-market trading. Broader market sentiment is influenced by rising crude oil prices and U.S.-Iran tensions.

21 июл. 2026 г., 19:16 UTC

Correlated Moves

Amkor Technology Inc shares are higher today, rebounding from earlier lows amid positive sentiment in the semiconductor sector and broader market recovery.

20 июл. 2026 г., 23:51 UTC

Amkor Technology Inc shares are trading higher in after-market hours, despite no specific news and increased caution in the broader market.

Сравнение c конкурентами

Изменение цены

Amkor Technology Inc Прогноз

Целевая цена

By TipRanks

37.51% рост

Прогноз на 12 месяцев

Средняя 76 USD 37.51%

Максимум 90 USD

Минимум 65 USD

Основано на мнении 6 аналитиков Wall Street, спрогнозировавших целевые цены для Amkor Technology Inc на следующие 12 месяцев – Данные за последние 3 месяца.

Консенсус по рейтингу

By TipRanks

Покупка

6 ratings

Покупка

Удержание

Продажа

Основано на мнении 6 аналитиков, присваивавших рейтинги акциям Amkor Technology Inc – Данные за последние 3 месяца.

Настроения

By Acuity

45 / 370Рейтинг в Технологии

Финансовые показатели

Расходы на продажи и администрирование

Операционные расходы

Прибыль до уплаты налогов

Продажи

Себестоимость реализации

Валовая прибыль от продаж

Процентные расходы по долгу

EBITDA

Операционная прибыль

О компании Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.