NVDA

188.98

+0.85%↑

AVGO.US

338.16

+1.31%↑

ORCL

289.19

-0.15%↓

CSCO

68.29

-0.7%↓

CRM

238.96

+1.42%↑

NVDA

188.98

+0.85%↑

AVGO.US

338.16

+1.31%↑

ORCL

289.19

-0.15%↓

CSCO

68.29

-0.7%↓

CRM

238.96

+1.42%↑

NVDA

188.98

+0.85%↑

AVGO.US

338.16

+1.31%↑

ORCL

289.19

-0.15%↓

CSCO

68.29

-0.7%↓

CRM

238.96

+1.42%↑

NVDA

188.98

+0.85%↑

AVGO.US

338.16

+1.31%↑

ORCL

289.19

-0.15%↓

CSCO

68.29

-0.7%↓

CRM

238.96

+1.42%↑

NVDA

188.98

+0.85%↑

AVGO.US

338.16

+1.31%↑

ORCL

289.19

-0.15%↓

CSCO

68.29

-0.7%↓

CRM

238.96

+1.42%↑

Search

Amkor Technology Inc

Fechado

SetorTecnologia

29.66 0.61

Visão Geral

Variação de preço das ações

24h

Atual

Mín

29.33

Máximo

29.96

Indicadores-chave

By Trading Economics

Rendimento

33M

55M

Vendas

190M

1.5B

P/E

Médio do Setor

23.377

76.739

Rendimento de Dividendos

1.13

Margem de lucro

3.642

Funcionários

28,300

EBITDA

62M

259M

Recomendações

By TipRanks

Recomendações

Comprar

Previsão para 12 meses

-15.64% downside

Dividendos

By Dow Jones

Rendimento de Dividendos

Médio do Setor

1.13%

2.64%

Próximos Ganhos

27 de out. de 2025

Próxima data de ex-dividendo

3 de dez. de 2025

Estatísticas de Mercado

By TradingEconomics

Capitalização de Mercado

852M

7B

Abertura anterior

29.05

Fecho anterior

29.66

Sentimento de Notícias

By Acuity

50%

50%

162 / 407 Ranking em Technology

Pontuação Técnica

By Trading Central

Confiança

Weak Bearish Evidence

Amkor Technology Inc Gráfico

O desempenho passado não é um indicador confiável de resultados futuros.

Notícias Relacionadas

25 de ago. de 2025, 23:02 UTC

Aquisições, Fusões, Aquisições de Empresas

The U.S. Has Created a Stealth Sovereign Wealth Fund. What Comes Next After Intel. -- Barrons.com

29 de jul. de 2025, 16:43 UTC

Ganhos

Amkor Stock Is Soaring After Earnings. Smartphones Raise Hope for More Gains. -- Barrons.com

Comparação entre Pares

Variação de preço

Amkor Technology Inc Previsão

Preço-alvo

By TipRanks

-15.64% parte inferior

Previsão para 12 meses

Média 24.86 USD  -15.64%

Máximo 30 USD

Mínimo 20 USD

Com base em 8 analistas de Wall Street que oferecem metas de preço de 12 meses para Amkor Technology Inc - Dist nos últimos 3 meses.

Consenso de Avaliação

By TipRanks

Comprar

8 ratings

4

Comprar

4

Manter

0

Vender

Pontuação Técnica

By Trading Central

17.795 / 18.14Suporte e Resistência

Curto Prazo

Weak Bearish Evidence

Médio Prazo

Bullish Evidence

Longo Prazo

Weak Bearish Evidence

Sentimento

By Acuity

162 / 407 Ranking em Tecnologia

Sentimento de Notícias

Neutral

Volatilidade

Abaixo da média

Volume de Notícias (RCV)

Abaixo da média

Informação Financeira

Custos administrativos e de venda

Custos Operacionais

Lucro antes de imposto

Vendas

Custo das vendas

Lucro bruto sobre vendas

Despesa com juros da dívida

EBITDA

Resultado Operacional

$

Sobre Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
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